Title :
Low temperature cofired ceramic: an enabler of high power RF integrated amplifiers
Author :
Piel, P.-M. ; Estes, J. ; Marshall, S. ; Funk, G. ; Pavio, A.
Author_Institution :
Motorola Inc., Tempe, AZ, USA
Abstract :
Multi-layer ceramic technologies have been viewed recently as an enabler to increase the electrical functionality in a cost effective manner for high power discrete transistors. High power applications have stringent requirements on conductor losses, thermal characteristics and repeatability of design. We present a characterization of these factors and a preliminary definition of the boundary conditions for use in RF integrated amplifiers.
Keywords :
UHF integrated circuits; UHF power amplifiers; ceramic packaging; power amplifiers; radiofrequency amplifiers; LTCC electrical modeling; LTCC substrates; LTCC technology; boundary conditions; conductor losses; design repeatability; high power RF integrated amplifiers; high power applications; low temperature cofired ceramic; multi-layer ceramic technologies; thermal characteristics; Capacitors; Ceramics; Computational modeling; Dielectric losses; High power amplifiers; Inductors; Packaging; Radio frequency; Radiofrequency amplifiers; Temperature;
Conference_Titel :
Microwave Symposium Digest, 2002 IEEE MTT-S International
Conference_Location :
Seattle, WA, USA
Print_ISBN :
0-7803-7239-5
DOI :
10.1109/MWSYM.2002.1012153
