Title :
Packaging aspects of the Jitney parallel optical interconnect
Author :
Cohen, M.S. ; Johnson, G.W. ; Kuchta, D.M. ; Pepeljugoski, Petar K ; Trewhella, J.W. ; Ouimet, S.E. ; Spanoudis, S.L.
Author_Institution :
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
Abstract :
The Jitney parallel optical interconnect is a prototype 20-channel wide, low cost data link, designed for operation at speeds up to one Gbyte/s over distances approaching 100 meters. The package is based on (1) an inexpensive overmolded leadframe, (2) passive optical alignment, and (3) plastic molded parts. The packaging challenges in the fabrication of the components, their assembly, and in the achievement of the performance goals are described
Keywords :
assembling; moulding; optical fibre couplers; optical interconnections; packaging; 1 Gbyte/s; 100 m; Jitney parallel optical interconnect; assembly; low cost data link; overmolded leadframe; packaging aspects; passive optical alignment; performance goals; plastic molded parts; Costs; High speed optical techniques; Optical arrays; Optical crosstalk; Optical fiber cables; Optical fiber couplers; Optical interconnections; Optical receivers; Optical transmitters; Packaging;
Conference_Titel :
Electronic Components & Technology Conference, 1998. 48th IEEE
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-4526-6
DOI :
10.1109/ECTC.1998.678877
