DocumentCode
1841564
Title
Radiofrequency power deposition near metallic wires during MR imaging: feasibility study using T1-weighted thermal imaging
Author
Oulmane, F. ; Detti, V. ; Grenier, D. ; Perrin, Eric ; Saint-Jalmes, Herve
Author_Institution
Univ. de Lyon, Villeurbanne
fYear
2007
fDate
22-26 Aug. 2007
Firstpage
3894
Lastpage
3897
Abstract
The presence of metallic conductors (implants, wires or catheters) is prohibited in MR imaging for safety purpose with respect to radiofrequency (RF) power deposition caused by RF excitation Bl field. This work describes the use of Tl-weigthed MR imaging for estimating a thermal map around a metallic (copper) wire located in the center of a MR imaging unit during an imaging sequence. The experimental set up and the methodology used for capturing the elevation of temperature created by radiofrequency power deposition around the wire is presented. A proof of its efficiency to follow- up temperature elevation about 0,5degC in a milimetric region of interest (pixel size: 1 times 1 mm2, slice thickness 5 mm) located around the wire is given, leading to further developments of MR imaging in presence of metallic implants, coils or catheters.
Keywords
biomedical MRI; biothermics; conductors (electric); copper; radiofrequency heating; Cu; MR imaging; RF excitation B1 field; T1 weighted thermal imaging; copper wire; metallic conductors; metallic wires; radiofrequency heating; radiofrequency power deposition; Catheters; Coils; Conductors; Copper; Implants; Pixel; Radio frequency; Safety; Temperature; Wires; Bone Wires; Copper; Hot Temperature; Humans; Magnetic Resonance Imaging; Phantoms, Imaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society, 2007. EMBS 2007. 29th Annual International Conference of the IEEE
Conference_Location
Lyon
ISSN
1557-170X
Print_ISBN
978-1-4244-0787-3
Type
conf
DOI
10.1109/IEMBS.2007.4353184
Filename
4353184
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