• DocumentCode
    1841564
  • Title

    Radiofrequency power deposition near metallic wires during MR imaging: feasibility study using T1-weighted thermal imaging

  • Author

    Oulmane, F. ; Detti, V. ; Grenier, D. ; Perrin, Eric ; Saint-Jalmes, Herve

  • Author_Institution
    Univ. de Lyon, Villeurbanne
  • fYear
    2007
  • fDate
    22-26 Aug. 2007
  • Firstpage
    3894
  • Lastpage
    3897
  • Abstract
    The presence of metallic conductors (implants, wires or catheters) is prohibited in MR imaging for safety purpose with respect to radiofrequency (RF) power deposition caused by RF excitation Bl field. This work describes the use of Tl-weigthed MR imaging for estimating a thermal map around a metallic (copper) wire located in the center of a MR imaging unit during an imaging sequence. The experimental set up and the methodology used for capturing the elevation of temperature created by radiofrequency power deposition around the wire is presented. A proof of its efficiency to follow- up temperature elevation about 0,5degC in a milimetric region of interest (pixel size: 1 times 1 mm2, slice thickness 5 mm) located around the wire is given, leading to further developments of MR imaging in presence of metallic implants, coils or catheters.
  • Keywords
    biomedical MRI; biothermics; conductors (electric); copper; radiofrequency heating; Cu; MR imaging; RF excitation B1 field; T1 weighted thermal imaging; copper wire; metallic conductors; metallic wires; radiofrequency heating; radiofrequency power deposition; Catheters; Coils; Conductors; Copper; Implants; Pixel; Radio frequency; Safety; Temperature; Wires; Bone Wires; Copper; Hot Temperature; Humans; Magnetic Resonance Imaging; Phantoms, Imaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2007. EMBS 2007. 29th Annual International Conference of the IEEE
  • Conference_Location
    Lyon
  • ISSN
    1557-170X
  • Print_ISBN
    978-1-4244-0787-3
  • Type

    conf

  • DOI
    10.1109/IEMBS.2007.4353184
  • Filename
    4353184