Title :
High performance packaging technique used for clamped gain semiconductor optical amplifier array modules fabrication
Author :
Grard, E. ; Le Bris, J. ; Di Maggio, M. ; Dorgeuille, F. ; Emery, J.Y. ; Bonno, Ph ; Renaud, M.
Author_Institution :
Alcatel Corp. Res. Centre, Marcoussis, France
Abstract :
In this paper, we present a high performance, versatile multifibre pigtailing technique adapted to tilted semiconductor optical amplifier arrays. Dynamic alignment of collectively processed tilted lensed ribbon fibre and YAG laser welding assembly are used for pigtailing of 4 clamped gain semiconductor optical amplifier array. The collective process makes this packaging technique attractive for array components. This paper describes the technology used and summarizes main results obtained on fabricated modules
Keywords :
laser beam welding; modules; optical fibre amplifiers; semiconductor device packaging; semiconductor laser arrays; semiconductor optical amplifiers; YAG; YAG laser welding assembly; YAl5O12; clamped gain semiconductor optical amplifier array; dynamic alignment; fabricated modules; high performance packaging; multifibre pigtailing; packaging; tilted lensed ribbon fibre; tilted semiconductor optical amplifier arrays; Arrayed waveguide gratings; Optical arrays; Optical coupling; Optical feedback; Optical fiber polarization; Optical saturation; Performance gain; Semiconductor device packaging; Semiconductor laser arrays; Semiconductor optical amplifiers;
Conference_Titel :
Electronic Components & Technology Conference, 1998. 48th IEEE
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-4526-6
DOI :
10.1109/ECTC.1998.678903