High performance packaging technique used for clamped gain semiconductor optical amplifier array modules fabrication

Author

Grard, E. ; Le Bris, J. ; Di Maggio, M. ; Dorgeuille, F. ; Emery, J.Y. ; Bonno, Ph ; Renaud, M.

Author_Institution

Alcatel Corp. Res. Centre, Marcoussis, France

fYear

1998

fDate

25-28 May 1998

Firstpage

1270

Lastpage

1273

Abstract

In this paper, we present a high performance, versatile multifibre pigtailing technique adapted to tilted semiconductor optical amplifier arrays. Dynamic alignment of collectively processed tilted lensed ribbon fibre and YAG laser welding assembly are used for pigtailing of 4 clamped gain semiconductor optical amplifier array. The collective process makes this packaging technique attractive for array components. This paper describes the technology used and summarizes main results obtained on fabricated modules

Keywords

laser beam welding; modules; optical fibre amplifiers; semiconductor device packaging; semiconductor laser arrays; semiconductor optical amplifiers; YAG; YAG laser welding assembly; YAl5O12; clamped gain semiconductor optical amplifier array; dynamic alignment; fabricated modules; high performance packaging; multifibre pigtailing; packaging; tilted lensed ribbon fibre; tilted semiconductor optical amplifier arrays; Arrayed waveguide gratings; Optical arrays; Optical coupling; Optical feedback; Optical fiber polarization; Optical saturation; Performance gain; Semiconductor device packaging; Semiconductor laser arrays; Semiconductor optical amplifiers;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components & Technology Conference, 1998. 48th IEEE

Conference_Location

Seattle, WA

ISSN

0569-5503

Print_ISBN

0-7803-4526-6

Type

conf

DOI

10.1109/ECTC.1998.678903

Filename

678903