• DocumentCode
    1841630
  • Title

    Electrical modeling of the chip scale BGA

  • Author

    Caggiano, Michael F. ; Brush, R.M. ; Kleban, J.T. ; Chuaypradit, P.J.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Rutgers Univ., Piscataway, NJ, USA
  • fYear
    1998
  • fDate
    25-28 May 1998
  • Firstpage
    1280
  • Lastpage
    1285
  • Abstract
    The CSBGA package-modeling program can rapidly generate a model from a specific description of a package or from partial information when only a rough approximation is needed. This innovative new software is targeted for the engineer who, at his desktop PC or workstation, can rapidly generate an accurate electrical model of a chip scale BGA. Program operation consists of entering the available data, and retrieving output that can be used in a simulation, or simply analyzed for an idea as to the range of values the parasitic effects take. The whole process will just take minutes. The program was designed to be fast and portable contrasting other methods of modeling in which such attributes were sacrificed for greater accuracy. Such accuracy may not be desired in most applications where there is a greater emphasis on speed or where powerful workstations are not available. The models targeted for both data processing and RF systems will have a wide range of use across military and commercial electronics applications
  • Keywords
    C language; ball grid arrays; chip scale packaging; digital simulation; integrated circuit modelling; CSBGA; RF systems; accurate electrical model; chip scale BGA; commercial electronics; data processing; package-modeling program; parasitic effects; simulation; Analytical models; Brushes; Capacitance; Data processing; Electronics packaging; Inductance; Information retrieval; Power system modeling; Radio frequency; Workstations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components & Technology Conference, 1998. 48th IEEE
  • Conference_Location
    Seattle, WA
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-4526-6
  • Type

    conf

  • DOI
    10.1109/ECTC.1998.678906
  • Filename
    678906