• DocumentCode
    1841687
  • Title

    Application of the CFS PML to the FDTD solution of wave-structure interaction problems

  • Author

    Berenger, J.-P.

  • Author_Institution
    Centre d´Analyse de Defense, Arcueil, France
  • Volume
    2
  • fYear
    2003
  • fDate
    22-27 June 2003
  • Firstpage
    984
  • Abstract
    When solving wave-structure interaction problems with the FDTD method, the perfectly matched layer (PML) absorbing boundary condition (ABC) can be set quite close to the structure of interest (J.-P. Berenger, IEEE Trans. Ant. and Propag., vol. 44, no. 1, pp. 110-117, 1996), so that the overall computational domain is widely reduced in comparison with previously used ABCs. Nevertheless, the PML must be some cells in thickness and it typically consumes 20-50% of the overall computational time. It would be desirable if this thickness were reduced. From theoretical investigations (J.-P. Berenger, ibid., vol. 47, no. 10, pp. 258-265, 2002), the complex frequency shifted (CFS) PML (M. Kuzuoglu and R. Mittra, IEEE Micr. and Guid. Wave Lett., vol. 6, no. 12, pp. 447-449, 1996) is a candidate in view of achieving such an objective. This is illustrated in the present paper by means of numerical experiments with three-dimensional structures.
  • Keywords
    boundary-value problems; computational complexity; computational electromagnetics; electromagnetic field theory; electromagnetic wave absorption; electromagnetic waves; finite difference time-domain analysis; 3D structures; CFS PML; FDTD; PML ABC; PML cell thickness; complex frequency shifted perfectly matched layer; computational domain; computational time; numerical experiments; perfectly matched layer absorbing boundary condition; wave-structure interaction problems; Absorption; Boundary conditions; Conductivity; Finite difference methods; Perfectly matched layers; Reflection; Resonance; Resonant frequency; Scattering; Time domain analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antennas and Propagation Society International Symposium, 2003. IEEE
  • Conference_Location
    Columbus, OH, USA
  • Print_ISBN
    0-7803-7846-6
  • Type

    conf

  • DOI
    10.1109/APS.2003.1219400
  • Filename
    1219400