DocumentCode :
1841994
Title :
Advanced thermal simulation of a circuit breaker
Author :
Frei, Peter U. ; Weichert, Hans O.
Author_Institution :
Rockwell Autom. AG, Aarau, Switzerland
fYear :
2004
fDate :
20-23 Sept. 2004
Firstpage :
104
Lastpage :
110
Abstract :
The quality of thermal simulation results depends on the accuracy of both the modelled heat sources and heat sinks. Starting from an existing simplified thermal simulation model, This work describes further steps towards a more accurate representation of the heat sinks in a circuit breaker. Heat generated in switchgear can leave the system either along the metallic conducting path to the connecting wires or through the case to the surrounding air. The former simulation model accurately represented the heat generation and the thermal path along the metallic conductor. However, the path through the case was only summarized by convection coefficients on the metallic parts´ surfaces. Due to the high performance requirements of modern breakers it is interesting to know not only the temperatures of the conducting parts but also the thermal impact on the plastic components supporting the conductors or providing essential functions. Therefore, the non-metallic parts of the circuit breaker (including the air within the device) are now part of the model. Consequently, the heat flux through the housing is a result of the simulation and not an estimated boundary condition any more. Moreover, conclusions can be drawn about the thermal stress of the plastic parts of the breaker.
Keywords :
circuit breakers; digital simulation; heat sinks; thermal analysis; thermal stresses; thermoelectricity; boundary condition; circuit breaker; heat flux; heat generation; heat sinks; heat sources; metallic conducting path; metallic conductor; metallic parts surface; nonmetallic parts; plastic components; switchgear; thermal path; thermal simulation model; thermal stress; Circuit breakers; Circuit simulation; Conductors; Heat sinks; Joining processes; Plastics; Switchgear; Thermal conductivity; Thermal stresses; Wires;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Contacts, 2004. Proceedings of the 50th IEEE Holm Conference on Electrical Contacts and the 22nd International Conference on Electrical Contacts
Print_ISBN :
0-7803-8460-1
Type :
conf
DOI :
10.1109/HOLM.2004.1353102
Filename :
1353102
Link To Document :
بازگشت