Title :
Electromagnetic analysis of high-density multi-chip module substrates having semi-custom interconnects
Author :
Beker, Benjamin ; Yee, Ian ; Miracky, Robert
Author_Institution :
Dept. of Electr. & Comput. Eng., South Carolina Univ., Columbia, SC, USA
Abstract :
This paper describes the modeling approach and numerical results of MCM transmission lines formed by interwoven metallization patterns. The impedance of the signal traces is calculated based on quasistatic field approximations. The differences between conventional microstrip and interwoven transmission lines are pointed out and ample data are provided for the “weaved” line as a function of several geometrical parameters
Keywords :
application specific integrated circuits; integrated circuit interconnections; multichip modules; wiring; MCM transmission lines; electromagnetic analysis; geometrical parameters; high-density multi-chip module substrates; interwoven metallization patterns; interwoven transmission lines; quasistatic field approximations; semi-custom interconnects; signal trace impedance; Capacitance; Electromagnetic analysis; Impedance; Inductance; Integrated circuit interconnections; Metallization; Microstrip; Power transmission lines; Signal design; Wiring;
Conference_Titel :
Electronic Components & Technology Conference, 1998. 48th IEEE
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-4526-6
DOI :
10.1109/ECTC.1998.678923
