• DocumentCode
    1842332
  • Title

    Development of On-Wafer Microstrip Characterization Techniques

  • Author

    Pham, A. ; Laskar, J. ; Schappacher, J.

  • Author_Institution
    School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0250
  • Volume
    29
  • fYear
    1996
  • fDate
    35217
  • Firstpage
    85
  • Lastpage
    94
  • Abstract
    We present methods for calibrating microstrip devices and circuits using coplanar microprobes and TRL calibration. An on-chip CPW to microstrip transition [1] is employed to measure accurate S-parameters to 50 GHz [1,2]. A CAD model, developed for the transition, is used to de-embed measured results when using a commercial calibration substrate with measurement reference planes at the probe tips. We also make TRL calibration artifacts which include CPW to microstrip transitions in the standards so that we can use the TFX algorithm to de-embed adapters on the ANA. These test methodologies can be used to characterize many types of microstrip devices including printed wire boards and thick film microwave substrates.
  • Keywords
    Calibration; Circuits; Coplanar waveguides; Microstrip; Probes; Scattering parameters; Substrates; Testing; Thick films; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ARFTG Conference Digest-Spring, 47th
  • Conference_Location
    San Francisco, CA, USA
  • Print_ISBN
    0-7803-5686-1
  • Type

    conf

  • DOI
    10.1109/ARFTG.1996.327168
  • Filename
    4119840