DocumentCode :
1842332
Title :
Development of On-Wafer Microstrip Characterization Techniques
Author :
Pham, A. ; Laskar, J. ; Schappacher, J.
Author_Institution :
School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0250
Volume :
29
fYear :
1996
fDate :
35217
Firstpage :
85
Lastpage :
94
Abstract :
We present methods for calibrating microstrip devices and circuits using coplanar microprobes and TRL calibration. An on-chip CPW to microstrip transition [1] is employed to measure accurate S-parameters to 50 GHz [1,2]. A CAD model, developed for the transition, is used to de-embed measured results when using a commercial calibration substrate with measurement reference planes at the probe tips. We also make TRL calibration artifacts which include CPW to microstrip transitions in the standards so that we can use the TFX algorithm to de-embed adapters on the ANA. These test methodologies can be used to characterize many types of microstrip devices including printed wire boards and thick film microwave substrates.
Keywords :
Calibration; Circuits; Coplanar waveguides; Microstrip; Probes; Scattering parameters; Substrates; Testing; Thick films; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
ARFTG Conference Digest-Spring, 47th
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-5686-1
Type :
conf
DOI :
10.1109/ARFTG.1996.327168
Filename :
4119840
Link To Document :
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