• DocumentCode
    1842428
  • Title

    The N-guide: A novel miniaturized hard quasi-TEM waveguide

  • Author

    Kehn, M.N.M. ; Kildal, P.-S.

  • Author_Institution
    Dept. of Electromagn., Chalmers Univ. of Technol., Gothenburg, Sweden
  • Volume
    2
  • fYear
    2003
  • fDate
    22-27 June 2003
  • Firstpage
    1111
  • Abstract
    Conventional metal waveguides need to have a width or diameter larger than typically 0.5/spl lambda/ in order to support waves. In several applications, such as e.g. multi-band arrays of slotted or open-ended waveguides, it is desirable with thinner miniaturized waveguides (one for each frequency band) that can be located side by side without introducing grating lobes in any band. Classical waveguides can be reduced in size by filling them with dielectric material, but this is not a good solution due to the losses in the dielectric, the increased weight, and because there is no air region inside where active components or tuning devices can be located. The purpose of the present paper is to introduce a new miniaturized quasi-TEM N-guide that is mainly air-filled. It is a folded version of the hard dielectric-loaded rectangular waveguide studied by M.N.M. Kehn and P.-S. Kildal (AP-S Int. Symp. 2002, vol. 3, pp. 790-793, 2002).
  • Keywords
    dielectric-loaded waveguides; rectangular waveguides; waveguide theory; N-Guide; active components; air region; air-filled quasi-TEM N-guide; dielectric losses; dielectric material filling; grating lobes; hard dielectric-loaded rectangular waveguide; metal waveguides; miniaturized hard quasi-TEM waveguide; miniaturized waveguides; multi-band arrays; open-ended waveguides; slotted waveguides; tuning devices; Arrayed waveguide gratings; Dielectric materials; Electromagnetic propagation; Electromagnetic scattering; Electromagnetic waveguides; Filling; Frequency; Rectangular waveguides; Shape; Waveguide components;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antennas and Propagation Society International Symposium, 2003. IEEE
  • Conference_Location
    Columbus, OH, USA
  • Print_ISBN
    0-7803-7846-6
  • Type

    conf

  • DOI
    10.1109/APS.2003.1219430
  • Filename
    1219430