Quantitative evaluation of passive-aligned laser diode-to-fiber coupling

Author

Lee, S.H. ; Joo, G.C. ; Lee, Y.H. ; Hwang, N. ; Song, M.K. ; Pyun, K.E.

Author_Institution

Electron. & Telecommun. Res. Inst., Daejeon, South Korea

fYear

1998

fDate

25-28 May 1998

Firstpage

1459

Lastpage

1463

Abstract

Quantitative evaluation of passive-aligned laser diode-to-fiber coupling is presented. From the assembly of 250 transmitter optical subassemblies, flip-chip bonding of laser chips and fiber fixing yields are reported. The coupling characteristics of passive-aligned laser diode modules are evaluated in comparison with the active alignment data and the misalignment tolerances. The assembly and coupling results have showed about 80% overall yield and 1.79 dB±1.55 dB excess coupling loss, respectively

Keywords

flip-chip devices; integrated optoelectronics; microassembling; modules; optical fibres; optical transmitters; packaging; semiconductor lasers; LD modules; coupling characteristics; fiber fixing yields; flip-chip bonding; laser chips; laser diode modules; misalignment tolerances; passive-aligned LD-to-fiber coupling; transmitter optical subassemblies; Assembly; Diode lasers; Fiber lasers; Optical coupling; Optical fibers; Optical films; Optical sensors; Optical transmitters; Packaging; Silicon;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components & Technology Conference, 1998. 48th IEEE

Conference_Location

Seattle, WA

ISSN

0569-5503

Print_ISBN

0-7803-4526-6

Type

conf

DOI

10.1109/ECTC.1998.678937

Filename

678937