Title :
Quantitative evaluation of passive-aligned laser diode-to-fiber coupling
Author :
Lee, S.H. ; Joo, G.C. ; Lee, Y.H. ; Hwang, N. ; Song, M.K. ; Pyun, K.E.
Author_Institution :
Electron. & Telecommun. Res. Inst., Daejeon, South Korea
Abstract :
Quantitative evaluation of passive-aligned laser diode-to-fiber coupling is presented. From the assembly of 250 transmitter optical subassemblies, flip-chip bonding of laser chips and fiber fixing yields are reported. The coupling characteristics of passive-aligned laser diode modules are evaluated in comparison with the active alignment data and the misalignment tolerances. The assembly and coupling results have showed about 80% overall yield and 1.79 dB±1.55 dB excess coupling loss, respectively
Keywords :
flip-chip devices; integrated optoelectronics; microassembling; modules; optical fibres; optical transmitters; packaging; semiconductor lasers; LD modules; coupling characteristics; fiber fixing yields; flip-chip bonding; laser chips; laser diode modules; misalignment tolerances; passive-aligned LD-to-fiber coupling; transmitter optical subassemblies; Assembly; Diode lasers; Fiber lasers; Optical coupling; Optical fibers; Optical films; Optical sensors; Optical transmitters; Packaging; Silicon;
Conference_Titel :
Electronic Components & Technology Conference, 1998. 48th IEEE
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-4526-6
DOI :
10.1109/ECTC.1998.678937
