Title :
Comparison of advanced measurement and modeling techniques for electrical characterization of ball grid array packages
Author :
Horng, T.S. ; Tseng, A. ; Huang, H.H. ; Wu, S.-M. ; Lee, J.J.
Author_Institution :
Inst. of Electr. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
Abstract :
Advanced measurement and modeling techniques are proposed in both the frequency domain and time domain to establish the high-frequency/high-speed equivalent models of Ball Grid Array (BGA) packages. In consideration of the adjacent coupled traces of the packages, the electrical parameters that are found include characteristic impedance, coupling coefficient, and propagation delay for the equivalent coupled transmission-line models, and self inductance, mutual inductance, loaded capacitance, and mutual capacitance for the equivalent lump models
Keywords :
capacitance; delays; electric impedance; equivalent circuits; frequency-domain analysis; inductance; integrated circuit modelling; integrated circuit packaging; integrated circuit testing; time-domain analysis; transmission line theory; BGA packages; advanced measurement techniques; advanced modeling techniques; ball grid array packages; characteristic impedance; coupling coefficient; electrical characterization; electrical parameters; equivalent coupled transmission-line models; equivalent lump models; high-frequency equivalent models; high-speed equivalent models; loaded capacitance; mutual capacitance; mutual inductance; propagation delay; self inductance; Capacitance; Electronics packaging; Frequency domain analysis; Frequency measurement; Impedance; Inductance; Mutual coupling; Propagation delay; Time measurement; Transmission lines;
Conference_Titel :
Electronic Components & Technology Conference, 1998. 48th IEEE
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-4526-6
DOI :
10.1109/ECTC.1998.678938
