Comparison of advanced measurement and modeling techniques for electrical characterization of ball grid array packages

Author

Horng, T.S. ; Tseng, A. ; Huang, H.H. ; Wu, S.-M. ; Lee, J.J.

Author_Institution

Inst. of Electr. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan

fYear

1998

fDate

25-28 May 1998

Firstpage

1464

Lastpage

1471

Abstract

Advanced measurement and modeling techniques are proposed in both the frequency domain and time domain to establish the high-frequency/high-speed equivalent models of Ball Grid Array (BGA) packages. In consideration of the adjacent coupled traces of the packages, the electrical parameters that are found include characteristic impedance, coupling coefficient, and propagation delay for the equivalent coupled transmission-line models, and self inductance, mutual inductance, loaded capacitance, and mutual capacitance for the equivalent lump models

Keywords

capacitance; delays; electric impedance; equivalent circuits; frequency-domain analysis; inductance; integrated circuit modelling; integrated circuit packaging; integrated circuit testing; time-domain analysis; transmission line theory; BGA packages; advanced measurement techniques; advanced modeling techniques; ball grid array packages; characteristic impedance; coupling coefficient; electrical characterization; electrical parameters; equivalent coupled transmission-line models; equivalent lump models; high-frequency equivalent models; high-speed equivalent models; loaded capacitance; mutual capacitance; mutual inductance; propagation delay; self inductance; Capacitance; Electronics packaging; Frequency domain analysis; Frequency measurement; Impedance; Inductance; Mutual coupling; Propagation delay; Time measurement; Transmission lines;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components & Technology Conference, 1998. 48th IEEE

Conference_Location

Seattle, WA

ISSN

0569-5503

Print_ISBN

0-7803-4526-6

Type

conf

DOI

10.1109/ECTC.1998.678938

Filename

678938