• DocumentCode
    1842697
  • Title

    Software for the analysis of 3-D devices formed by several rectangular waveguides with different axes, connected together through a central parallelepiped lossless cavity

  • Author

    Bregon, C.D. ; Fernandez del Rio, J.E.

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Univ. Europea, Madrid, Spain
  • Volume
    2
  • fYear
    2003
  • fDate
    22-27 June 2003
  • Firstpage
    1169
  • Abstract
    In this communication, a commercial CAD software to analyze and optimize 3D multiport waveguide devices is presented. The program implements the generalized admittance matrix (GAM) method for the analysis and a hybrid optimizer based on genetic algorithms (GA) and the gradient method, for the optimization. The part dealing with the optimization has been previously developed by RYMSA Co., where they are using it for the optimization of a number of electromagnetic problems. It is important to point out that this software has a broader range of application, in the sense that, since the two parts (analysis and optimization) can run independently to each other, the optimizer can be used to solve any kind of parametric optimization problem.
  • Keywords
    computational electromagnetics; electric admittance; electronic design automation; genetic algorithms; gradient methods; modal analysis; multiport networks; rectangular waveguides; 3D device analysis; CAD aided modal analysis; CAD software; GA; GAM method; generalized admittance matrix; genetic algorithms; gradient optimization method; multiport networks; multiport waveguide devices; parallelepiped lossless cavity connection; rectangular waveguides; Admittance; Algorithm design and analysis; Application software; Design automation; Electromagnetic waveguides; Genetic algorithms; Optimization methods; Rectangular waveguides; Stochastic processes; Transmission line matrix methods;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antennas and Propagation Society International Symposium, 2003. IEEE
  • Conference_Location
    Columbus, OH, USA
  • Print_ISBN
    0-7803-7846-6
  • Type

    conf

  • DOI
    10.1109/APS.2003.1219443
  • Filename
    1219443