DocumentCode
1842791
Title
Compensating differences between measurement and calibration wafer in probe-tip calibrations
Author
Carchon, G. ; De Raedt, W. ; Beyne, E.
Author_Institution
IMEC, Heverlee, Belgium
Volume
3
fYear
2002
fDate
2-7 June 2002
Firstpage
1837
Abstract
Differences in probe-tip-to-line geometry and substrate permittivity between measurement and calibration wafer deteriorate measurement accuracy. In this paper, we compare the accuracy of several models for the probe-to-line transition based on measurements as well as 3-D simulations of various GaAs CPW lines. This shows that 3-D simulations may be used to determine the parasitics at the probe tip as an alternative to measurement based methods. In general, models using 4 error-parameters are preferred to the Y/sub p/- or TL-based model as they provide a higher accuracy while the same amount of measurements is required to implement them.
Keywords
III-V semiconductors; calibration; coplanar waveguides; gallium arsenide; microwave measurement; 3D simulation; GaAs; GaAs CPW line; TL model; Y/sub p/ model; calibration wafer; compensation; error parameters; measurement wafer; parasitics; probe-tip calibration; probe-to-line transition; substrate permittivity; Calibration; Coplanar waveguides; Gallium arsenide; Geometry; Impedance measurement; Inductance; Length measurement; Permittivity measurement; Probes; Strips;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 2002 IEEE MTT-S International
Conference_Location
Seattle, WA, USA
ISSN
0149-645X
Print_ISBN
0-7803-7239-5
Type
conf
DOI
10.1109/MWSYM.2002.1012220
Filename
1012220
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