• DocumentCode
    1842791
  • Title

    Compensating differences between measurement and calibration wafer in probe-tip calibrations

  • Author

    Carchon, G. ; De Raedt, W. ; Beyne, E.

  • Author_Institution
    IMEC, Heverlee, Belgium
  • Volume
    3
  • fYear
    2002
  • fDate
    2-7 June 2002
  • Firstpage
    1837
  • Abstract
    Differences in probe-tip-to-line geometry and substrate permittivity between measurement and calibration wafer deteriorate measurement accuracy. In this paper, we compare the accuracy of several models for the probe-to-line transition based on measurements as well as 3-D simulations of various GaAs CPW lines. This shows that 3-D simulations may be used to determine the parasitics at the probe tip as an alternative to measurement based methods. In general, models using 4 error-parameters are preferred to the Y/sub p/- or TL-based model as they provide a higher accuracy while the same amount of measurements is required to implement them.
  • Keywords
    III-V semiconductors; calibration; coplanar waveguides; gallium arsenide; microwave measurement; 3D simulation; GaAs; GaAs CPW line; TL model; Y/sub p/ model; calibration wafer; compensation; error parameters; measurement wafer; parasitics; probe-tip calibration; probe-to-line transition; substrate permittivity; Calibration; Coplanar waveguides; Gallium arsenide; Geometry; Impedance measurement; Inductance; Length measurement; Permittivity measurement; Probes; Strips;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest, 2002 IEEE MTT-S International
  • Conference_Location
    Seattle, WA, USA
  • ISSN
    0149-645X
  • Print_ISBN
    0-7803-7239-5
  • Type

    conf

  • DOI
    10.1109/MWSYM.2002.1012220
  • Filename
    1012220