• DocumentCode
    1843080
  • Title

    Development of Microwave Package Characterization Technique

  • Author

    Pham, A. ; Chun, C. ; Laskar, J. ; Hutchison, Brian

  • Author_Institution
    School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0250
  • Volume
    30
  • fYear
    1996
  • fDate
    Dec. 1996
  • Firstpage
    59
  • Lastpage
    64
  • Abstract
    We present a plastic package characterization technique using coplanar waveguide to package adapter (CPA) and LRM calibrations. LRM calibrations used with off-set CPA standards are employed to de-embed the response of CPA adapters in measured S-parameters. A variety of small shrink outline packages (SSOP) has been characterized to 26.5 GHz using this technique.
  • Keywords
    Calibration; Circuit simulation; Coplanar waveguides; Electronics packaging; Equivalent circuits; Microwave technology; Microwave theory and techniques; Pins; Plastic packaging; Scattering parameters;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ARFTG Conference Digest-Fall, 48th
  • Conference_Location
    Clearwater, FL, USA
  • Print_ISBN
    0-7803-5686-1
  • Type

    conf

  • DOI
    10.1109/ARFTG.1996.327189
  • Filename
    4119871
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1843080