Title :
Development of Microwave Package Characterization Technique
Author :
Pham, A. ; Chun, C. ; Laskar, J. ; Hutchison, Brian
Author_Institution :
School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0250
Abstract :
We present a plastic package characterization technique using coplanar waveguide to package adapter (CPA) and LRM calibrations. LRM calibrations used with off-set CPA standards are employed to de-embed the response of CPA adapters in measured S-parameters. A variety of small shrink outline packages (SSOP) has been characterized to 26.5 GHz using this technique.
Keywords :
Calibration; Circuit simulation; Coplanar waveguides; Electronics packaging; Equivalent circuits; Microwave technology; Microwave theory and techniques; Pins; Plastic packaging; Scattering parameters;
Conference_Titel :
ARFTG Conference Digest-Fall, 48th
Conference_Location :
Clearwater, FL, USA
Print_ISBN :
0-7803-5686-1
DOI :
10.1109/ARFTG.1996.327189
