• DocumentCode
    1843480
  • Title

    Thermally induced mechanical degradation of contact spots in aluminum interfaces

  • Author

    Ruppert, Christopher ; Runde, Magne

  • Author_Institution
    Dept. of Electr. & Semicond., European Patent Office, Den Haag, Netherlands
  • fYear
    2004
  • fDate
    20-23 Sept. 2004
  • Firstpage
    494
  • Lastpage
    501
  • Abstract
    Deterioration of an electric contact is closely related to phenomena occurring in the microscopic contact spots in the contact interface. Contact spots in idealized aluminum/aluminum contact interfaces, that have passed heavy alternating currents, have been carefully examined by scanning electron microscopy and metallographic imaging techniques. Small cracks are observed in the contact spot regions, and have to a great extent impaired the current-carrying ability of the area. The temperature in the contact spots cycles with twice the power frequency, and in heavily stressed contacts the maximum temperature reaches several hundred degrees centigrade. The associated local thermal expansion and contraction in and around the immediate vicinity of the contact spot generates cyclic mechanical forces of substantial magnitudes. Indications that this repetitive stress causes the observed cracks are found. It is suggested that the resistance increase observed in practical aluminum connectors being subjected to short-circuit currents can have a similar origin.
  • Keywords
    aluminium; contact resistance; electric connectors; electrical contacts; metallography; scanning electron microscopy; short-circuit currents; thermal expansion; thermal stress cracking; Al-Al; aluminium-aluminium contact interface; aluminum connectors; contact spots cycles; cracks; cyclic mechanical forces; electric contact; metallographic imaging techniques; microscopic contact spots; scanning electron microscopy; short-circuit currents; thermal contraction; thermal expansion; thermally induced mechanical degradation; Aluminum; Connectors; Contacts; Frequency; Scanning electron microscopy; Temperature; Thermal degradation; Thermal expansion; Thermal force; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Contacts, 2004. Proceedings of the 50th IEEE Holm Conference on Electrical Contacts and the 22nd International Conference on Electrical Contacts
  • Print_ISBN
    0-7803-8460-1
  • Type

    conf

  • DOI
    10.1109/HOLM.2004.1353162
  • Filename
    1353162