DocumentCode
1844018
Title
Multiple scattering among vias in planar waveguides using SMCG method
Author
Chung-Chi Huang ; Leung Tsang ; Chi Hou Chan
Author_Institution
Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
Volume
3
fYear
2002
fDate
2-7 June 2002
Firstpage
2045
Abstract
Large scale full-wave solution of multiple scattering among cylindrical vias in planar waveguides is modeled using Foldy-Lax equations. Solution of the Foldy-Lax equations with large number of unknowns is done efficiently using the sparse-matrix canonical-grid method. In the method, interactions among vias are decomposed into strong interactions part and weak interactions part where the calculation can be carried out using 2D-FFT after the locations of the vias have been translated onto the uniform grids. The final solution of the Foldy-Lax equations is calculated by iterative method with matrix-vector multiplication speeded up by the 2D-FFT operation. The results show O(NlogN) CPU efficiency and O(N) memory efficiency and make large scale via problem possible for computer simulation.
Keywords
electromagnetic wave scattering; fast Fourier transforms; iterative methods; planar waveguides; sparse matrices; waveguide theory; 2D-FFT; CPU efficiency; Foldy-Lax equations; SMCG method; computer simulation; cylindrical vias; iterative method; large scale full-wave solution; large scale via problem; matrix-vector multiplication; memory efficiency; multiple scattering; planar waveguides; sparse-matrix canonical-grid method; strong interactions; uniform grids; weak interactions; Electromagnetic scattering; Electromagnetic waveguides; Equations; Frequency; Integrated circuit interconnections; Iterative methods; Large-scale systems; Matrix decomposition; Planar waveguides; Transmission line matrix methods;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 2002 IEEE MTT-S International
Conference_Location
Seattle, WA, USA
ISSN
0149-645X
Print_ISBN
0-7803-7239-5
Type
conf
DOI
10.1109/MWSYM.2002.1012270
Filename
1012270
Link To Document