• DocumentCode
    1844018
  • Title

    Multiple scattering among vias in planar waveguides using SMCG method

  • Author

    Chung-Chi Huang ; Leung Tsang ; Chi Hou Chan

  • Author_Institution
    Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
  • Volume
    3
  • fYear
    2002
  • fDate
    2-7 June 2002
  • Firstpage
    2045
  • Abstract
    Large scale full-wave solution of multiple scattering among cylindrical vias in planar waveguides is modeled using Foldy-Lax equations. Solution of the Foldy-Lax equations with large number of unknowns is done efficiently using the sparse-matrix canonical-grid method. In the method, interactions among vias are decomposed into strong interactions part and weak interactions part where the calculation can be carried out using 2D-FFT after the locations of the vias have been translated onto the uniform grids. The final solution of the Foldy-Lax equations is calculated by iterative method with matrix-vector multiplication speeded up by the 2D-FFT operation. The results show O(NlogN) CPU efficiency and O(N) memory efficiency and make large scale via problem possible for computer simulation.
  • Keywords
    electromagnetic wave scattering; fast Fourier transforms; iterative methods; planar waveguides; sparse matrices; waveguide theory; 2D-FFT; CPU efficiency; Foldy-Lax equations; SMCG method; computer simulation; cylindrical vias; iterative method; large scale full-wave solution; large scale via problem; matrix-vector multiplication; memory efficiency; multiple scattering; planar waveguides; sparse-matrix canonical-grid method; strong interactions; uniform grids; weak interactions; Electromagnetic scattering; Electromagnetic waveguides; Equations; Frequency; Integrated circuit interconnections; Iterative methods; Large-scale systems; Matrix decomposition; Planar waveguides; Transmission line matrix methods;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest, 2002 IEEE MTT-S International
  • Conference_Location
    Seattle, WA, USA
  • ISSN
    0149-645X
  • Print_ISBN
    0-7803-7239-5
  • Type

    conf

  • DOI
    10.1109/MWSYM.2002.1012270
  • Filename
    1012270