• DocumentCode
    1844066
  • Title

    Integrated modeling of nonlinear dynamics and contact mechanics of electrostatically actuated RF-MEMS switches

  • Author

    Do, Cuong ; Cychowski, Marcin ; Lishchynska, Maryna ; Hill, Martin ; Delaney, Kieran

  • Author_Institution
    NIMBUS Centre, Cork Inst. of Technol., Cork, Ireland
  • fYear
    2010
  • fDate
    7-10 Nov. 2010
  • Firstpage
    2293
  • Lastpage
    2298
  • Abstract
    In this work, a novel nonlinear dynamic model is developed to investigate the bouncing and deformation behaviors of an electrostatically actuated, ohmic-contact RF-MEMS switch. The model accounts for a real geometry, the electrostatic actuation, squeeze-film damping effect, and the nonlinear elastic-plastic contact mechanics using Hertz theory. A low-complexity formulation based on finite differential analysis is employed to solve the model equations in the time-domain. The proposed methodology is validated using a real four-contact RF-MEMS switch with complex geometry. The simulation results of the switch performance in the on-stage (closure) are in good agreement with experimental measurements demonstrating that the model is very effective in capturing the bouncing and contact deformation phenomena accurately. It is foreseen that the proposed approach will be instrumental in providing a better insight into the reliability of MEMS switches and will, ultimately, found a basis of developing and implementing control strategies to maximize their lifetime.
  • Keywords
    damping; finite difference methods; mechanical contact; microswitches; nonlinear dynamical systems; reliability; Hertz theory; electrostatically actuated RF-MEMS switches; finite differential analysis; nonlinear dynamic model; nonlinear elastic-plastic contact mechanics; ohmic-contact RF-MEMS switch; squeeze-film damping effect; Contacts; Damping; Deformable models; Electrostatics; Force; Mathematical model; Microswitches;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    IECON 2010 - 36th Annual Conference on IEEE Industrial Electronics Society
  • Conference_Location
    Glendale, AZ
  • ISSN
    1553-572X
  • Print_ISBN
    978-1-4244-5225-5
  • Electronic_ISBN
    1553-572X
  • Type

    conf

  • DOI
    10.1109/IECON.2010.5675110
  • Filename
    5675110