Title :
Embedded Multiconductor Transmission Line Characterization
Author :
Williams, Dylan F.
Author_Institution :
National Institute of Standards and Technology, 325 Broadway, Boulder, CO 80303
Abstract :
This paper presents a measurement method that characterizes lossy printed multiconductor transmission lines embedded in transitions, connectors, or packages with significant electrical parasitics. we test the method on a pair of lossy coupled asymmetric microstrip lines and compare to previous results.
Keywords :
Connectors; Couplings; Electric variables measurement; Loss measurement; Microstrip; Multiconductor transmission lines; Packaging; Propagation losses; Testing; Transmission line measurements;
Conference_Titel :
ARFTG Conference Digest-Spring, 49th
Conference_Location :
Denver, CO, USA
Print_ISBN :
0-7803-5686-1
DOI :
10.1109/ARFTG.1997.327233
