Title :
IC package and bonding wire modeling software and its application to RFIC design
Author :
Goto, K. ; Dec, A. ; Horio, Y. ; Suyama, K. ; Akima, H.
Author_Institution :
Tokyo Denki Univ., Japan
Abstract :
This paper presents an IC package and bonding wire modeling software which generates an equivalent lumped circuit model from physical information of IC package and bonding wires. The resulting model takes into account the effects of frequency-dependent resistance, capacitance, as well as self and mutual inductance. The accuracy of the modeling approach has been verified using a 20-pin lead-less plastic chip carrier package. Furthermore, the application of the IC package characterization software to the design of a 700 MHz CMOS VCO has also been demonstrated.
Keywords :
SPICE; UHF integrated circuits; circuit simulation; equivalent circuits; inductance; integrated circuit design; integrated circuit modelling; integrated circuit packaging; lead bonding; plastic packaging; voltage-controlled oscillators; 700 MHz; CMOS VCO; IC package modeling; RFIC design; bonding wire modeling; equivalent lumped circuit model; frequency-dependent resistance; lead-less plastic chip carrier package; mutual inductance; package characterization software; self inductance; Application software; Application specific integrated circuits; Bonding; Capacitance; Frequency; Integrated circuit modeling; Integrated circuit packaging; Semiconductor device modeling; Software packages; Wire;
Conference_Titel :
Microwave Symposium Digest, 2002 IEEE MTT-S International
Conference_Location :
Seattle, WA, USA
Print_ISBN :
0-7803-7239-5
DOI :
10.1109/MWSYM.2002.1012286
