IC package and bonding wire modeling software and its application to RFIC design

Author

Goto, K. ; Dec, A. ; Horio, Y. ; Suyama, K. ; Akima, H.

Author_Institution

Tokyo Denki Univ., Japan

Volume

3

fYear

2002

fDate

2-7 June 2002

Firstpage

2109

Abstract

This paper presents an IC package and bonding wire modeling software which generates an equivalent lumped circuit model from physical information of IC package and bonding wires. The resulting model takes into account the effects of frequency-dependent resistance, capacitance, as well as self and mutual inductance. The accuracy of the modeling approach has been verified using a 20-pin lead-less plastic chip carrier package. Furthermore, the application of the IC package characterization software to the design of a 700 MHz CMOS VCO has also been demonstrated.

Keywords

SPICE; UHF integrated circuits; circuit simulation; equivalent circuits; inductance; integrated circuit design; integrated circuit modelling; integrated circuit packaging; lead bonding; plastic packaging; voltage-controlled oscillators; 700 MHz; CMOS VCO; IC package modeling; RFIC design; bonding wire modeling; equivalent lumped circuit model; frequency-dependent resistance; lead-less plastic chip carrier package; mutual inductance; package characterization software; self inductance; Application software; Application specific integrated circuits; Bonding; Capacitance; Frequency; Integrated circuit modeling; Integrated circuit packaging; Semiconductor device modeling; Software packages; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 2002 IEEE MTT-S International

Conference_Location

Seattle, WA, USA

ISSN

0149-645X

Print_ISBN

0-7803-7239-5

Type

conf

DOI

10.1109/MWSYM.2002.1012286

Filename

1012286