Title :
Thermal management using interleaved CVD diamond layers for high power 3D chip stacks
Author :
Ozguz, V. ; Albert, D. ; Camien, A. ; Ludwig, D. ; Patra, S.
Author_Institution :
Irvine Sensors Corp., Costa Mesa, CA, USA
Abstract :
The use of CVD diamond layers as a thermal management tool for the implementation of 3D stacks will allow up to 100 W power dissipation in 3D-MCM applications
Keywords :
CVD coatings; cooling; diamond; integrated circuit packaging; multichip modules; 100 W; 3D-MCM applications; C; high power 3D chip stacks; interleaved CVD diamond layers; power dissipation; thermal management; Electronic packaging thermal management; Energy management; Heat sinks; Power system management; Silicon; Stacking; Temperature; Testing; Thermal management; Thermal resistance;
Conference_Titel :
Integrated Power Packaging, 1998. IWIPP. Proceedings., IEEE International Workshop on
Conference_Location :
Chicago, IL
Print_ISBN :
0-7803-5033-2
DOI :
10.1109/IWIPP.1998.722309
