Sea of polymer pillars: dual-mode electrical-optical Input/Output interconnections

Author

Bakir, Muhannad S. ; Villalaz, Ricardo A. ; Ogunsola, Oluwafemi 0. ; Gaylord, Thomas K. ; Kohl, Paul A. ; Martin, Kevin P. ; Meindl, James D.

Author_Institution

Microelectron. Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA

fYear

2003

fDate

2-4 June 2003

Firstpage

77

Lastpage

79

Abstract

Sea of Polymer Pillars (SoPP) provides highly integrated wafer-level optical and electrical Input/Output (I/O) interconnections for the die-to-module/board interconnection level. The advantages of this integrated interconnection technology include dual-mode I/O interconnections, high I/O density (>10⁵/cm²), high performance, compliant electrical and optical interconnects, ease of assembly, wafer-level test compatibility, and ease of fabrication. The purpose of this paper is to extend the work developed by describing SoPP configurations, fabrication, and measurements.

Keywords

chip-on-board packaging; integrated circuit interconnections; integrated circuit testing; metallisation; modules; optical interconnections; polymers; spin coating; I/O density; die-module/board interconnection; dual mode optical input/output interconnections; integrated wafer dual-mode electrical input/output interconnections; polymer pillars fabrication; wafer-level test compatibility; Couplers; Gratings; Mirrors; Optical crosstalk; Optical films; Optical interconnections; Optical polymers; Optical refraction; Optical waveguides; Polymer films;

fLanguage

English

Publisher

ieee

Conference_Titel

Interconnect Technology Conference, 2003. Proceedings of the IEEE 2003 International

Print_ISBN

0-7803-7797-4

Type

conf

DOI

10.1109/IITC.2003.1219718

Filename

1219718