Title :
An overview of stress free polishing of Cu with ultra low-k(k<2.0) films
Author :
Pallinti, Jayanthi ; Lakshminarayanan, S. ; Barth, Will ; Wright, Peter ; Lu, Michael ; Reder, Steve ; Kwak, Leo ; Catabay, Wilbur ; Wang, David ; Ho, Fred
Author_Institution :
Adv. Process Module Dev., LSI Logic Corp., Gresham, OR, USA
Abstract :
An overview of the process performance of Stress Free Polishing technology (SFP) for copper removal at sub 90 nm nodes is presented in this paper. A brief description of the SFP process and polishing characteristics is provided along with electrical results. Dependence of post SFP copper surface quality on the roughness of the incoming films and post plating anneal conditions is also discussed.
Keywords :
annealing; copper; dielectric thin films; polishing; surface roughness; 90 nm; Cu; copper surface quality; post plating annealing; stress free polishing; ultra low-k films; Chemical technology; Copper; Delamination; Etching; Large scale integration; Logic; Planarization; Rough surfaces; Stress; Surface roughness;
Conference_Titel :
Interconnect Technology Conference, 2003. Proceedings of the IEEE 2003 International
Print_ISBN :
0-7803-7797-4
DOI :
10.1109/IITC.2003.1219719
