DocumentCode :
1844862
Title :
Global coupled EM-electrical-thermal simulation and experimental validation for a spatial power combining MMIC array
Author :
Batty, W. ; Christoffersen, C.E. ; Yakovlev, A.B. ; Whitaker, J.F. ; Ozkar, M. ; Ortiz, S. ; Mortazawi, A. ; Reano, R. ; Yang, K. ; Katehi, L.P.B. ; Snowden, C.M. ; Steer, M.B.
Author_Institution :
Sch. of Electron. & Electr. Eng., Leeds Univ., UK
Volume :
3
fYear :
2002
fDate :
2-7 June 2002
Firstpage :
2177
Abstract :
The first fully coupled electromagnetic-electro-thermal global simulation of a large microwave subsystem, here a whole spatial power combining MMIC array, is described. The modeling effort is supported by parallel developments in electro-optic and thermal measurement. The CAD tools and experimental characterisation described, provide a unique capability for the design of quasi-optical systems and for the exploration of the fundamental physics of spatial power combining devices.
Keywords :
MMIC; arrays; circuit simulation; digital simulation; electromagnetic field theory; electronic design automation; impedance matrix; power combiners; thermal analysis; waveguide theory; CAD tools; EM admittance matrix model; EM modeling environment; X-band array; amplifier array; experimental characterisation; full-wave analysis; global circuit simulation; global coupled EM-electrical-thermal simulation; large microwave subsystem; modeling; quasi-optical system design; spatial power combining MMIC array; waveguide-based aperture-coupled patch array; Circuit simulation; Computational modeling; Design automation; Electromagnetic coupling; MMICs; Microwave antenna arrays; Microwave circuits; Object oriented modeling; Physics; Power system modeling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Symposium Digest, 2002 IEEE MTT-S International
Conference_Location :
Seattle, WA, USA
ISSN :
0149-645X
Print_ISBN :
0-7803-7239-5
Type :
conf
DOI :
10.1109/MWSYM.2002.1012303
Filename :
1012303
Link To Document :
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