Title :
Thermal design considerations for medium voltage power converters with 15 kV SiC IGBTs
Author :
Madhusoodhanan, Sachin ; Mainali, Krishna ; Tripathi, Awneesh ; Kadavelugu, Arun ; Patel, Dhaval ; Bhattacharya, Subhashish
Author_Institution :
Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
Abstract :
Medium Voltage (MV) Silicon Carbide (SiC) devices such as the 15 kV SiC IGBT have better thermal handling capability compared to Silicon (Si) based devices. These devices also have lower switching and conduction losses, at high switching frequencies and high power levels, respectively. The maximum safe operating junction temperature for the 15 kV SiC IGBT is 175 °C. This enables high power density design of the MV converters using this device. Heat sink with forced air cooling is sufficient for dissipating the heat generated during converter operation. In this paper, the thermal design of 3-phase MV converters based on 15 kV/40 A SiC N-IGBT is discussed. The design is carried out based on experimental loss data and the continuous heat-run test of the device. It is supported by analytical calculations and FEM simulations in COMSOL Multiphysics simulation software. Hardware prototypes of the converters are developed and experimental results are given.
Keywords :
finite element analysis; heat sinks; insulated gate bipolar transistors; power convertors; silicon compounds; 3-phase MV converter; COMSOL multiphysics simulation software; FEM simulation; MV silicon carbide IGBT; SiC; conduction loss; forced air cooling; heat sink; junction temperature; maximum safe operating junction temperature; medium voltage power converter; thermal handling capability; voltage 15 kV; Heat sinks; Heating; Insulated gate bipolar transistors; Junctions; Resistance; Silicon carbide; Switches;
Conference_Titel :
Power Electronics for Distributed Generation Systems (PEDG), 2015 IEEE 6th International Symposium on
Conference_Location :
Aachen
DOI :
10.1109/PEDG.2015.7223105