• DocumentCode
    1845044
  • Title

    Dynamic compact thermal model of a package

  • Author

    Mohammadi, F. ; Marami, M.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Ryerson Univ., Toronto, ON
  • fYear
    2008
  • fDate
    18-21 May 2008
  • Firstpage
    2869
  • Lastpage
    2872
  • Abstract
    This paper presents the generation and verification of a dynamic compact thermal model of electronic packages. The method is demonstrated for ball grid array (BGA) package. The resulting RC network dynamic compact thermal model is optimized to diverse conditions typical to the application-specific environment. The accuracy of the model is found sufficient for thermal design purposes in terms of predicted junction temperature response and heat flux of the desired locations of the package.
  • Keywords
    ball grid arrays; RC network dynamic compact thermal model; ball grid array package; electronic packages; heat flux; junction temperature response; Boundary conditions; Electronic packaging thermal management; Electronics packaging; Finite element methods; Packaging machines; Power system modeling; Solid modeling; Steady-state; Temperature; Thermal engineering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 2008. ISCAS 2008. IEEE International Symposium on
  • Conference_Location
    Seattle, WA
  • Print_ISBN
    978-1-4244-1683-7
  • Electronic_ISBN
    978-1-4244-1684-4
  • Type

    conf

  • DOI
    10.1109/ISCAS.2008.4542056
  • Filename
    4542056
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1845044