Title :
Dynamic compact thermal model of a package
Author :
Mohammadi, F. ; Marami, M.
Author_Institution :
Dept. of Electr. & Comput. Eng., Ryerson Univ., Toronto, ON
Abstract :
This paper presents the generation and verification of a dynamic compact thermal model of electronic packages. The method is demonstrated for ball grid array (BGA) package. The resulting RC network dynamic compact thermal model is optimized to diverse conditions typical to the application-specific environment. The accuracy of the model is found sufficient for thermal design purposes in terms of predicted junction temperature response and heat flux of the desired locations of the package.
Keywords :
ball grid arrays; RC network dynamic compact thermal model; ball grid array package; electronic packages; heat flux; junction temperature response; Boundary conditions; Electronic packaging thermal management; Electronics packaging; Finite element methods; Packaging machines; Power system modeling; Solid modeling; Steady-state; Temperature; Thermal engineering;
Conference_Titel :
Circuits and Systems, 2008. ISCAS 2008. IEEE International Symposium on
Conference_Location :
Seattle, WA
Print_ISBN :
978-1-4244-1683-7
Electronic_ISBN :
978-1-4244-1684-4
DOI :
10.1109/ISCAS.2008.4542056
