Title :
A semi-lumped balun fabricated by low temperature co-fired ceramic
Author :
Ching-Wen Tang ; Chi-Yang Chang
Author_Institution :
Phycomp Taiwan Ltd., Kaohsiung, Taiwan
Abstract :
A new chip-type multi-layer ceramic balun is presented in this paper. This balun is designed in the ISM band and fabricated using low temperature co-fired ceramic (LTCC) technology. It involves the semi-lumped concept and the multi-layer structure to realize the LTCC-MLC balun. The symmetric structure provides the excellent characteristics of phase balance and amplitude balancing. Measured results of the LTCC-MLC balun match well with the computer simulation.
Keywords :
UHF circuits; baluns; ceramic packaging; equivalent circuits; 2.25 to 2.65 GHz; LTCC technology; LTCC-MLC balun; MIM capacitors; RF components; amplitude balancing; chip-type balun; low temperature co-fired ceramic technology; multi-layer ceramic balun; phase balance; semi-lumped concept; symmetric structure; Ceramics; Coupling circuits; Distributed parameter circuits; Fabrication; Impedance matching; Inductance; MIM capacitors; Radio frequency; Temperature; Transmission lines;
Conference_Titel :
Microwave Symposium Digest, 2002 IEEE MTT-S International
Conference_Location :
Seattle, WA, USA
Print_ISBN :
0-7803-7239-5
DOI :
10.1109/MWSYM.2002.1012309
