Al/SiC baseplate hybrid power modules: evaluation of the thermomechanical performances

Author

Azzopardi, S. ; Thébaud, J.M. ; Worigard, E. ; Zardini, C. ; Sablé, P.

Author_Institution

Bordeaux I Univ., Talence, France

fYear

1998

fDate

17-19 Sep 1998

Firstpage

74

Lastpage

78

Abstract

This paper deals with an evaluation of the performances of hybrid power modules using Al/SiC Metal Matrix Composite (MMC) baseplates. In this study, we analyse the possible damage in the assemblies by measuring their thermal resistance. Results show that even after 2700 thermal shocks, only a very small increase of the thermal resistance of the assemblies is observed. In comparison, modules with copper baseplates show a strong increase of the thermal resistance and fail well before. As a consequence, in applications where thermal cycling is involved, hybrid power modules with Al/SiC MMC baseplates will offer a much better reliability. SEM observations conducted on cross-sectioned samples do not show the typical cracks generally observed in solder joints between the Direct Bonded Copper (DBC) ceramic substrate and the copper baseplate of aged modules

Keywords

aluminium; hybrid integrated circuits; integrated circuit packaging; integrated circuit reliability; particle reinforced composites; power integrated circuits; scanning electron microscopy; silicon compounds; thermal resistance; Al; SEM observations; SiC; hybrid power modules; metal matrix composite baseplates; reliability; thermal cycling; thermal resistance; thermomechanical performances; Assembly; Bonding; Copper; Electric shock; Electrical resistance measurement; Multichip modules; Performance evaluation; Silicon carbide; Soldering; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Integrated Power Packaging, 1998. IWIPP. Proceedings., IEEE International Workshop on

Conference_Location

Chicago, IL

Print_ISBN

0-7803-5033-2

Type

conf

DOI

10.1109/IWIPP.1998.722311

Filename

722311