Title :
RF-microwave multi-band design solutions for multilayer organic system on package integrated passives
Author :
Davis, M.F. ; Yoon, S.-W. ; Mandal, S. ; Bushyager, N. ; Maeng, M. ; Lim, K. ; Pinel, S. ; Sutono, A. ; Laskar, J. ; Tentzeris, M. ; Nonaka, T. ; Sundaram, V. ; Liu, F. ; Tummala, R.
Author_Institution :
Sch. of ECE, Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
We present multi-band design solutions for integrated passives using multilayer organic (MLO) process technology for RF and microwave System on Package (SOP) module development. The components developed in this technology include embedded high-Q compact inductors and filters designed in three frequency bands: S, C and Ku applicable for Bluetooth, MMDS, IEEE802.11a WLAN and satellite communications. Measured inductor Q-factor as high as 182 and Self-Resonant-Frequency (SRF) as high as 20 GHz, which represents the highest Q in its frequency range reported to date in a multilayer technology, have been demonstrated. A time domain electromagnetic modeling technique is also use to characterize the passive devices.
Keywords :
Q-factor; UHF circuits; UHF filters; inductors; microwave circuits; microwave filters; packaging; passive filters; 20 GHz; C-band; Ku-band; Q-factor; RF multi-band design solutions; S-band; embedded filters; embedded high-Q inductors; multilayer organic SOP integrated passives; multilayer organic process technology; self-resonant-frequency; system on package integrated passives; system-on-package module development; time domain electromagnetic modeling; Band pass filters; Bluetooth; Inductors; Microwave filters; Microwave technology; Nonhomogeneous media; Packaging; Radio frequency; Satellite communication; Wireless LAN;
Conference_Titel :
Microwave Symposium Digest, 2002 IEEE MTT-S International
Conference_Location :
Seattle, WA, USA
Print_ISBN :
0-7803-7239-5
DOI :
10.1109/MWSYM.2002.1012313
