• DocumentCode
    1845164
  • Title

    RF-microwave multi-band design solutions for multilayer organic system on package integrated passives

  • Author

    Davis, M.F. ; Yoon, S.-W. ; Mandal, S. ; Bushyager, N. ; Maeng, M. ; Lim, K. ; Pinel, S. ; Sutono, A. ; Laskar, J. ; Tentzeris, M. ; Nonaka, T. ; Sundaram, V. ; Liu, F. ; Tummala, R.

  • Author_Institution
    Sch. of ECE, Georgia Inst. of Technol., Atlanta, GA, USA
  • Volume
    3
  • fYear
    2002
  • fDate
    2-7 June 2002
  • Firstpage
    2217
  • Abstract
    We present multi-band design solutions for integrated passives using multilayer organic (MLO) process technology for RF and microwave System on Package (SOP) module development. The components developed in this technology include embedded high-Q compact inductors and filters designed in three frequency bands: S, C and Ku applicable for Bluetooth, MMDS, IEEE802.11a WLAN and satellite communications. Measured inductor Q-factor as high as 182 and Self-Resonant-Frequency (SRF) as high as 20 GHz, which represents the highest Q in its frequency range reported to date in a multilayer technology, have been demonstrated. A time domain electromagnetic modeling technique is also use to characterize the passive devices.
  • Keywords
    Q-factor; UHF circuits; UHF filters; inductors; microwave circuits; microwave filters; packaging; passive filters; 20 GHz; C-band; Ku-band; Q-factor; RF multi-band design solutions; S-band; embedded filters; embedded high-Q inductors; multilayer organic SOP integrated passives; multilayer organic process technology; self-resonant-frequency; system on package integrated passives; system-on-package module development; time domain electromagnetic modeling; Band pass filters; Bluetooth; Inductors; Microwave filters; Microwave technology; Nonhomogeneous media; Packaging; Radio frequency; Satellite communication; Wireless LAN;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest, 2002 IEEE MTT-S International
  • Conference_Location
    Seattle, WA, USA
  • ISSN
    0149-645X
  • Print_ISBN
    0-7803-7239-5
  • Type

    conf

  • DOI
    10.1109/MWSYM.2002.1012313
  • Filename
    1012313