DocumentCode :
1845310
Title :
Spreading antenna effect of plasma induced charging damage in damascene interconnect process
Author :
Matsunaga, Noriaki ; Yamaguchi, Hitomi ; Shibata, Hideki
Author_Institution :
SoC Res. & Dev. Center, Toshiba Corp., Kanagawa, Japan
fYear :
2003
fDate :
2-4 June 2003
Firstpage :
198
Lastpage :
200
Abstract :
Electric charge injection mechanism of plasma induced charging damage (PID) in a damascene interconnect process was investigated in detail. In the damascene interconnect process, PID is mainly induced in the deposition processes of Cu diffusion barrier film and inter layer dielectrics (ILD). We found that the antenna area dependence of the PID in the damascene interconnect process is not a simple relation to the top surface area of wiring. Since the charges are injected through the dielectric films on the wiring, effective antenna area which can collect the charges became larger than the area defined by the top surface area of the metal wiring.
Keywords :
antennas in plasma; charge injection; copper; dielectric materials; dielectric thin films; diffusion barriers; integrated circuit interconnections; metallic thin films; plasma CVD; surface charging; Cu; Cu diffusion barrier film; damascene interconnect process; electric charge injection; inter layer dielectrics; metal wiring; plasma induced charging damage; spreading antenna effect; surface area; Degradation; Dielectric films; Electrodes; MOSFET circuits; Plasma applications; Plasma chemistry; Research and development; Space charge; Surface charging; Wiring;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Interconnect Technology Conference, 2003. Proceedings of the IEEE 2003 International
Print_ISBN :
0-7803-7797-4
Type :
conf
DOI :
10.1109/IITC.2003.1219753
Filename :
1219753
Link To Document :
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