DocumentCode
1845519
Title
Partition length between board-level electrical and optical interconnects
Author
Naeemi, Azad ; Mule, Anthony V. ; Meindl, James D.
Author_Institution
Microelectron. Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
fYear
2003
fDate
2-4 June 2003
Firstpage
230
Lastpage
232
Abstract
The lengths beyond which board-level optical interconnects are capable of transferring a larger number of bits per second in comparison with electrical interconnects are found for different technology generations. At the 130 nm node, the partition length is 29 cm which reduces to 8.3 cm at the 45 nm because of 7 times faster drivers and 40% finer waveguide pitch.
Keywords
optical interconnections; optical waveguides; 130 nm; 29 cm; 45 nm; 8.3 cm; board level electrical interconnects; board-level optical interconnects; finer waveguide pitch; partition length; Aggregates; Bandwidth; Conducting materials; Integrated circuit interconnections; Optical attenuators; Optical interconnections; Optical receivers; Optical waveguides; Wire; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Interconnect Technology Conference, 2003. Proceedings of the IEEE 2003 International
Print_ISBN
0-7803-7797-4
Type
conf
DOI
10.1109/IITC.2003.1219762
Filename
1219762
Link To Document