Title :
Partition length between board-level electrical and optical interconnects
Author :
Naeemi, Azad ; Mule, Anthony V. ; Meindl, James D.
Author_Institution :
Microelectron. Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
The lengths beyond which board-level optical interconnects are capable of transferring a larger number of bits per second in comparison with electrical interconnects are found for different technology generations. At the 130 nm node, the partition length is 29 cm which reduces to 8.3 cm at the 45 nm because of 7 times faster drivers and 40% finer waveguide pitch.
Keywords :
optical interconnections; optical waveguides; 130 nm; 29 cm; 45 nm; 8.3 cm; board level electrical interconnects; board-level optical interconnects; finer waveguide pitch; partition length; Aggregates; Bandwidth; Conducting materials; Integrated circuit interconnections; Optical attenuators; Optical interconnections; Optical receivers; Optical waveguides; Wire; Wiring;
Conference_Titel :
Interconnect Technology Conference, 2003. Proceedings of the IEEE 2003 International
Print_ISBN :
0-7803-7797-4
DOI :
10.1109/IITC.2003.1219762
