DocumentCode :
1845520
Title :
Study on wafer-level packaging and electrochemical characterization of planar AgCl micro reference electrode
Author :
Huang, I-Yu ; Hsieh, Chia-Hsu ; Chu, Chi-Chih
Author_Institution :
Dept. of Electr. Eng., Nation Sun Yat-sen Univ., Kaohsiung, Taiwan
fYear :
2009
fDate :
18-21 Oct. 2009
Firstpage :
37
Lastpage :
43
Abstract :
This study proposes a novel chip-level packaged planar Ti/Pd/Ag/AgCI/KCI-gel micro reference electrode for the electrochemical and biomedical sensing applications. The miniaturized reference electrode is constructed by two wafers ("Ti/Pd/Ag/AgCI quasi reference electrode wafer" and "KCI-gel cap sealing wafer") and with a total dimension of only 9 mm (L) × 6 mm (W) × 1 mm (H), hundredfold less than the commercial Ag/AgCI reference electrode (OD = 12 mm). Many excellent characteristics were demonstrated by the optimized encapsulated solid-state micro reference electrode, including a very stable cell potential (5 mV drift voltage in 30,000 s), an approximately zero offset-voltage, a very low impedance (<;1.50 kΩ) and phase shift (<;8.98°) at normal operation frequency range (0~1 kHz), and a low electro-chemical noise spectrum.
Keywords :
chip scale packaging; electrochemical electrodes; microelectrodes; palladium; potassium compounds; silver; silver compounds; titanium; wafer level packaging; KCl-gel cap sealing wafer; Ti-Pd-Ag-AgCl-KCl; biomedical sensing application; chip-level packaged planar microreference electrode; electrochemical application; electrochemical characterization; low electro-chemical noise spectrum; miniaturized reference electrode; optimized encapsulated solid-state microreference electrode; phase shift; quasireference electrode wafer; size 1 mm to 9 mm; voltage 5 mV; wafer-level packaging; zero offset-voltage; Chip-level packaging; Drift and offset voltage; Impedance and phase shift; Micro reference electrode; Noise analysis; Reproducibility;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nano/Molecular Medicine and Engineering (NANOMED), 2009 IEEE International Conference on
Conference_Location :
Tainan
Print_ISBN :
978-1-4244-5528-7
Type :
conf
DOI :
10.1109/NANOMED.2009.5559122
Filename :
5559122
Link To Document :
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