Title :
Analysis of Microvia Interconnects
Author :
Abhari, Ramesh ; Van Deventer, T.E.
Author_Institution :
Department of Electrical and Computer Engineering University of Toronto, 10 King¿s College Road, Ontario M5S 3G4, CANADA
Abstract :
The development of high density circuitry has promoted the introduction of the microvia technology which relies on organic dielectrics and vertical interconnects of reduced dimensions. In this paper, microvia interconnects are evaluated both through simulation using an FDTD model and experimental measurements, and have shown good electrical performance.
Keywords :
Circuit simulation; Dielectric measurements; Dielectric substrates; Etching; Finite difference methods; Integrated circuit interconnections; Nonhomogeneous media; Plasma applications; Reflection; Time domain analysis;
Conference_Titel :
ARFTG Conference Digest-Spring, 51st
Conference_Location :
Baltimore, MD, USA
Print_ISBN :
0-7803-5686-1
DOI :
10.1109/ARFTG.1998.327298
