DocumentCode :
1845756
Title :
Application of lumped RthCth and approximate steady-state methods for reducing transient analysis solution time
Author :
Larson, Steven E.
Author_Institution :
Automotive Commun. & Electron. Syst. Group, Motorola Inc., Northbrook, IL, USA
fYear :
2002
fDate :
2002
Firstpage :
85
Lastpage :
90
Abstract :
Three-dimensional, transient computational fluid-dynamic (CFD) models require finite-volume grids in the spatial as well as temporal domain. The grid can become extremely large, even for component-level problems. This initially results in long computation times during grid optimization, even with high-speed and parallel processing computers. It also results in extremely long computation times once the grid has been optimized. Solution times are further increased when the transient load is cyclic in nature. To reduce computation time, lumped resistance-capacitance (RthCth) methods developed by Larson and Li [2000] were benchmarked at the component level, then the system level. Next, the use of root-mean-squared current (I.) as a steady-state approximation was benchmarked at both the component and system level. Finally, both methods were applied to streamline the analysis of automotive electronic controls. Limitations of both the RthCth and steady-state methods are discussed. Cycle time reduction values for both component and system level are presented.
Keywords :
automotive electronics; computational fluid dynamics; finite volume methods; natural convection; packaging; transient analysis; approximate steady-state methods; automotive electronic controls; component-level problems; computation times; computational fluid-dynamic models; cycle time reduction values; finite-volume grids; grid optimization; lumped RthCth approximations; root-mean-squared current; spatial domain; steady-state approximation; temporal domain; transient analysis solution time; transient load; Computational fluid dynamics; Conductors; Electric resistance; Equations; Heat transfer; Power system modeling; Steady-state; Temperature; Thermal conductivity; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on
ISSN :
1089-9870
Print_ISBN :
0-7803-7152-6
Type :
conf
DOI :
10.1109/ITHERM.2002.1012442
Filename :
1012442
Link To Document :
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