DocumentCode :
1845794
Title :
Thermal challenges in the future generation solid state lighting applications: light emitting diodes
Author :
Arik, Mehmet ; Petroski, James ; Weaver, Stanton
Author_Institution :
Corporate Res. & Dev., Gen. Electr. Co., Niskayuna, NY, USA
fYear :
2002
fDate :
2002
Firstpage :
113
Lastpage :
120
Abstract :
Light emitting diodes, LEDs, historically have been used for indicators and produced low amounts of heat. The introduction of high brightness LEDs with white light and monochromatic colors have led to a movement towards specialty and general illumination applications. The increased electrical currents used to drive the LEDs have focused more attention on the thermal paths in the level-1 packages and developments in LED power packaging. The luminous efficiency of LEDs is expected to reach over 80 lumens/watt, that is approximately 6 times more than one tungsten bulb. The thermal challenges of these products in many applications will open new research areas for engineers from chip level to system level thermal management.
Keywords :
brightness; light emitting diodes; lighting; semiconductor device packaging; thermal management (packaging); chip level thermal management; electrical currents; general illumination applications; high brightness LEDs; level-1 packages; light emitting diodes; luminous efficiency; solid state lighting applications; system level thermal management; thermal paths; Brightness; Engineering management; Light emitting diodes; Packaging; Power engineering and energy; Power system management; Solid state lighting; Thermal engineering; Thermal management; Tungsten;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on
ISSN :
1089-9870
Print_ISBN :
0-7803-7152-6
Type :
conf
DOI :
10.1109/ITHERM.2002.1012446
Filename :
1012446
Link To Document :
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