• DocumentCode
    1845833
  • Title

    In vivo characterization of viscoelastic properties of human skin using dynamic micro-indentation

  • Author

    Boyer, G. ; Zahouani, H. ; Le Bot, A. ; Laquieze, L.

  • Author_Institution
    CNRS, Lyon
  • fYear
    2007
  • fDate
    22-26 Aug. 2007
  • Firstpage
    4584
  • Lastpage
    4587
  • Abstract
    The human skin, the interface between the body and the outside environment, has a very complex mechanical behaviour. Knowledge of its in vivo mechanical characteristics is essential to characterize the effects of medical or cosmetic products. The aim of this work is to present a non-invasive device using dynamic indentation to quantify the viscoelatic properties of human skin in vivo. The frequency and strain amplitude are in the range of 10 to 60 Hz and 1 to 10 mum. The results on 4 subjects show that a Kelvin Voigt model describes the mechanical behaviour of in vivo human skin with dynamic indentation well. The frequency average values of stiffness and damping have also been used to compare skin properties. We found a stiffness value of 47.3 to 128.3 N/m, and damping of 0.08 to 0.121 N.s/m, corresponding to a complex modulus of 13.2 to 33.4 kPa. These results show the ability of this device to characterize viscoelastic properties of human skin.
  • Keywords
    biomechanics; biomedical equipment; biomedical measurement; indentation; skin; viscoelasticity; Kelvin Voigt model; complex mechanical behaviour; damping; dynamic microindentation; frequency 10 Hz to 60 Hz; human skin; in vivo mechanical characteristics; noninvasive device; stiffness; strain amplitude; viscoelastic property; Capacitive sensors; Damping; Dermis; Elasticity; Frequency; Humans; In vivo; Mechanical factors; Skin; Viscosity; Cosmetics; Drug Evaluation; Elasticity; Models, Biological; Skin; Skin Physiological Phenomena;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2007. EMBS 2007. 29th Annual International Conference of the IEEE
  • Conference_Location
    Lyon
  • ISSN
    1557-170X
  • Print_ISBN
    978-1-4244-0787-3
  • Type

    conf

  • DOI
    10.1109/IEMBS.2007.4353360
  • Filename
    4353360