DocumentCode
1845928
Title
Minimizing scatter in experimental data sets
Author
Stout, Roger P.
Author_Institution
Adv. Packaging Technol., ON Semicond., Phoenix, AZ, USA
fYear
2002
fDate
2002
Firstpage
157
Lastpage
164
Abstract
Thermal transient data collected to characterize packaged semiconductor devices is often acquired from a number of individual samples that then must be averaged together. Yet each individual transient curve has a relatively large experimental uncertainty which is usually a combination of unmeasurable initial transient thermal response (related to electrical transients which cannot be separated from the thermal signal), coupled with mounting variability not fairly attributable to the device itself being tested (but is rather due to differences in test board characteristics, solder thickness variation, etc.). When a limited range of the data is believed to accurately represent device-only dependence, a useful, simple, yet rigorous method has been developed to allow the analyst to minimize the scatter in the data set, while preserving the average value in the specified range. Application of this method to actual data is presented for purposes of illustration, and additional implications in the use of the method are discussed. Although this method was developed and is applied here in the context of thermal transient characterization, it is universal in potential application; the underlying mathematical "theorem" is completely general.
Keywords
semiconductor device packaging; thermal resistance; transient response; average value; data set; electrical transients; experimental uncertainty; mounting variability; packaged semiconductor devices; rigorous method; solder thickness variation; test board characteristics; thermal transient data; transient curve; unmeasurable initial transient thermal response; Cooling; Electrical resistance measurement; Power measurement; Scattering; Semiconductor device packaging; Semiconductor devices; Steady-state; Temperature distribution; Testing; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on
ISSN
1089-9870
Print_ISBN
0-7803-7152-6
Type
conf
DOI
10.1109/ITHERM.2002.1012452
Filename
1012452
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