DocumentCode :
1846057
Title :
Mixed convection cooling of horizontally mounted printed circuit board
Author :
Kehoe, E. ; Davies, M.
Author_Institution :
Dept. of Mech. & Aeronaut. Eng., Limerick Univ., Ireland
fYear :
2002
fDate :
2002
Firstpage :
201
Lastpage :
208
Abstract :
Mixed convection is a fundamentally significant heat transfer mechanism that is of great interest to thermal designers in the field of electronic cooling. Given that its occurrence is frequent there is a necessity to understand the physics of this fundamental mechanism at board level. This paper is concerned with the development of optical measurement techniques for mixed convection, in order to try and improve the current understanding of why, where, and when mixed convection occurs. It is motivated both by a desire to gain an understanding of the fundamental physics of mixed convection and to solve design problems in electronic cooling applications where mixed convection often occurs. It is focused on heated horizontal ribs, which are a two dimensional approximation of super ball grid array, mounted on a printed circuit board in cross-flow at a low Reynolds number, high Grashof numbers and at the Prandtl number for air. A physical description of the flow is discussed through interferometric images and PIV streamlines and explanation is given as to how the mean Nusselt number varies in terms of rib position and power input.
Keywords :
ball grid arrays; convection; cooling; laser velocimetry; light interferometry; Grashof numbers; PIV streamlines; Prandtl number; Reynolds number; board mounted components; electronic cooling; heated horizontal ribs; horizontally mounted printed circuit board; interferometric images; mixed convection cooling; optical measurement techniques; power input; rib position; super ball grid array; two dimensional approximation; Circuit testing; Cooling; Heat transfer; Power measurement; Printed circuits; Ribs; Temperature measurement; Thermal conductivity; Thermal expansion; Thermal force;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on
ISSN :
1089-9870
Print_ISBN :
0-7803-7152-6
Type :
conf
DOI :
10.1109/ITHERM.2002.1012458
Filename :
1012458
Link To Document :
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