DocumentCode :
1846076
Title :
Flow transitions and heat transfer in open block tandem channels
Author :
del Valle, Manel ; Carrasco, Alex M. ; Guzmán, Amador M.
Author_Institution :
Departmento de Ingenieria Mecanica, Univ. de Santiago de Chile, Chile
fYear :
2002
fDate :
2002
Firstpage :
209
Lastpage :
217
Abstract :
This work investigates the transition scenario and heat transfer characteristics in a channel with a block tandem, as the flow evolves from a laminar to a transitional regime, by two-dimensional direct numerical simulations (DNS) of the time dependent, incompressible continuity, Navier-Stokes and energy equations. This investigation uses an extended computational domain with 10 blocks to determine the existence of a fully developed flow and self-similar temperature profiles, and a reduced computational domain to investigate the heat transfer enhancement for laminar and transitional flow regimes. This investigation demonstrates that significant heat transfer enhancements can be obtained at supercritical transitional flow Reynolds numbers with a minimum of dissipation due to viscous stresses. This enhancement is obtained without the necessity of operating this channel to high volumetric flow rates associated to turbulent flow regimes, which demand high pumping powers. In this channel, the transitional flow regime is more efficient than a laminar flow regime as a method of cooling electronics.
Keywords :
Navier-Stokes equations; bifurcation; channel flow; cooling; heat transfer; laminar flow; packaging; Hopf bifurcations; Navier-Stokes equations; computational domain; cooling; critical Reynolds numbers; energy equations; flow transitions; fully developed flow; heat transfer; incompressible continuity equations; laminar regime; open block tandem channels; self-similar temperature profiles; supercritical transitional flow; transitional regime; two-dimensional direct numerical simulations; viscous stresses; Bifurcation; Electronics cooling; Friction; Heat transfer; Navier-Stokes equations; Numerical simulation; Stress; Temperature; Thermal conductivity; Viscosity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on
ISSN :
1089-9870
Print_ISBN :
0-7803-7152-6
Type :
conf
DOI :
10.1109/ITHERM.2002.1012459
Filename :
1012459
Link To Document :
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