Title :
An experimental study on flow patterns and heat transfer enhancement in low-Reynolds-Rayleigh-number channel flow
Author :
Huang, X.Y. ; Zhang, H.
Author_Institution :
Sch. of Mech. & Production Eng., Nanyang Technol. Univ., Singapore, Singapore
Abstract :
An experimental study was conducted on buoyancy-induced flow patterns and heat transfer characteristics of airflow through a horizontal rectangular channel. The channel had an aspect ratio of six, and its bottom and sidewalls were heated, whereas the top of the channel was cooled. The experiments were conducted at Reynolds numbers of 40 and 100 and Rayleigh numbers ranging from 100 to 4200. The Nusselt number and the temperature distributions on the top surface of the channel were measured simultaneously at different thermal/flow conditions, and the heat transfer characteristics of the channel were evaluated, together with the flow patterns in the channel. The results showed that due to the heated sidewalls, which was an ´imperfect´ factor comparing with the classic Rayleigh-Benard channel, longitudinal vortex rolls can occur at a Rayleigh number Ra=100, starting with number of rolls N=2 and then N=4 as Ra increases, rather than the N=6 mode for the same channel with ´perfect´ sidewalls. It was demonstrated that the high modes can be excited actively in the channel to produce significant heat transfer enhancement in low Reynolds and Rayleigh number flow.
Keywords :
Benard convection; channel flow; cooling; packaging; temperature distribution; Nusselt number; Rayleigh numbers; Rayleigh-Benard convection; Reynolds numbers; buoyancy-induced flow patterns; channel aspect ratio; electronics cooling; flow patterns; heat transfer enhancement; heated sidewalls; horizontal rectangular channel; imperfect factor; longitudinal vortex rolls; low-Reynolds-Rayleigh-number channel flow; temperature distributions; Acceleration; Electronics cooling; Fluid flow measurement; Heat transfer; Production; Space heating; Telecommunication computing; Temperature distribution; Thermal conductivity; Thermal expansion;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on
Print_ISBN :
0-7803-7152-6
DOI :
10.1109/ITHERM.2002.1012460