Title :
Measuring and Modeling Package Interconnects Using Vector Network Analyzers and Time Domain Transforms
Author_Institution :
Hewlett - Packard Company, Santa Rosa, CA 95403
Keywords :
Distortion measurement; Electronics packaging; Fixtures; Impedance; Radio frequency; Reflection; Time domain analysis; Time measurement; Transmission line measurements; Voltage;
Conference_Titel :
ARFTG Conference Digest-Fall, 52nd
Conference_Location :
Rohnert Park, CA, USA
Print_ISBN :
0-7803-5686-1
DOI :
10.1109/ARFTG.1998.327324