DocumentCode :
1846174
Title :
Measuring and Modeling Package Interconnects Using Vector Network Analyzers and Time Domain Transforms
Author :
Dunsmore, Joel
Author_Institution :
Hewlett - Packard Company, Santa Rosa, CA 95403
Volume :
34
fYear :
1998
fDate :
Dec. 1998
Firstpage :
107
Lastpage :
127
Keywords :
Distortion measurement; Electronics packaging; Fixtures; Impedance; Radio frequency; Reflection; Time domain analysis; Time measurement; Transmission line measurements; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
ARFTG Conference Digest-Fall, 52nd
Conference_Location :
Rohnert Park, CA, USA
Print_ISBN :
0-7803-5686-1
Type :
conf
DOI :
10.1109/ARFTG.1998.327324
Filename :
4120009
Link To Document :
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