DocumentCode
1846244
Title
Experimental analysis of shrouded pin fin heat sinks for electronic equipment cooling
Author
Ryu, Ho Chul ; Kim, Duckjong ; Kim, Sung Jin
Author_Institution
Dept. of Mech. Eng., Korea Adv. Inst. of Sci. & Technol., Taejon, South Korea
fYear
2002
fDate
2002
Firstpage
261
Lastpage
266
Abstract
In the present work, heat transfer and fluid flow in square pin fin heat sinks are analyzed through an experimental method. Twenty aluminum square pin fin heat sinks having a 101.43 mm × 101.43 mm base size are tested with inlet velocity ranging from 1 m/s to 5 m/s. In each test, the heat sink is heated uniformly at the bottom. From the experimental results, effects of the height of the heat sink and the ratio of the spacing between the adjacent fins to the fin pitch on the pressure drop across the heat sink and the thermal resistance of the heat sink are investigated. In addition, design guidelines for shrouded square pin fin heat sinks are suggested considering both pumping power and thermal resistance.
Keywords
aluminium; cooling; flow through porous media; heat sinks; packaging; thermal resistance; 1 to 5 m/s; 101.43 mm; Al; adjacent fin spacing; aluminum square pin fin heat sinks; base size; design guidelines; electronic equipment cooling; fin pitch; fluid flow; heat sink height; heat transfer; inlet velocity; pressure drop; pumping power; shrouded pin fin heat sinks; surface porosity; thermal resistance; uniform bottom heating; Aluminum; Electronic equipment; Electronics cooling; Fluid flow; Guidelines; Heat sinks; Heat transfer; Resistance heating; Testing; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on
ISSN
1089-9870
Print_ISBN
0-7803-7152-6
Type
conf
DOI
10.1109/ITHERM.2002.1012466
Filename
1012466
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