• DocumentCode
    1846244
  • Title

    Experimental analysis of shrouded pin fin heat sinks for electronic equipment cooling

  • Author

    Ryu, Ho Chul ; Kim, Duckjong ; Kim, Sung Jin

  • Author_Institution
    Dept. of Mech. Eng., Korea Adv. Inst. of Sci. & Technol., Taejon, South Korea
  • fYear
    2002
  • fDate
    2002
  • Firstpage
    261
  • Lastpage
    266
  • Abstract
    In the present work, heat transfer and fluid flow in square pin fin heat sinks are analyzed through an experimental method. Twenty aluminum square pin fin heat sinks having a 101.43 mm × 101.43 mm base size are tested with inlet velocity ranging from 1 m/s to 5 m/s. In each test, the heat sink is heated uniformly at the bottom. From the experimental results, effects of the height of the heat sink and the ratio of the spacing between the adjacent fins to the fin pitch on the pressure drop across the heat sink and the thermal resistance of the heat sink are investigated. In addition, design guidelines for shrouded square pin fin heat sinks are suggested considering both pumping power and thermal resistance.
  • Keywords
    aluminium; cooling; flow through porous media; heat sinks; packaging; thermal resistance; 1 to 5 m/s; 101.43 mm; Al; adjacent fin spacing; aluminum square pin fin heat sinks; base size; design guidelines; electronic equipment cooling; fin pitch; fluid flow; heat sink height; heat transfer; inlet velocity; pressure drop; pumping power; shrouded pin fin heat sinks; surface porosity; thermal resistance; uniform bottom heating; Aluminum; Electronic equipment; Electronics cooling; Fluid flow; Guidelines; Heat sinks; Heat transfer; Resistance heating; Testing; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on
  • ISSN
    1089-9870
  • Print_ISBN
    0-7803-7152-6
  • Type

    conf

  • DOI
    10.1109/ITHERM.2002.1012466
  • Filename
    1012466