DocumentCode
1846256
Title
Thermal/fluid performance evaluation of serrated plate fin heat sinks
Author
Shwaish, Ibraheem K. ; Amon, Cristina H. ; Murthy, Jayathi Y.
Author_Institution
Dept. of Mech. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
fYear
2002
fDate
2002
Firstpage
267
Lastpage
275
Abstract
Cooling of the electronics in people movers and other rail transportation systems require the removal of high power dissipation from the electronic equipment to ensure their long term reliability and performance. In this study, the thermal performance of in-service serrated plate fin heat sink is evaluated for a range of Reynolds number by means of fully three-dimensional numerical simulations of the air flow over the heat sink. The flow is considered to be turbulent and both hydrodynamically and thermally developing. Our computations yield local and global heat transfer and flow parameters such as temperature distribution in the fin, heat transfer coefficient, Nusselt number, pressure drop, and the maximum temperature of the heat sink. The results point to the directions for optimizing the heat sink performance. Hence, variations of design parameters around the existing configurations are investigated. These parameters are fin interruption and staggering, fin height, serration spacing, fin thickness and inter-fin spacing, fin base thickness, and clearance gap between the fin tips and the upper wall of the channel that encloses the heat sink. The computations yield the optimal designs of plate fin heat sinks for transportation applications.
Keywords
channel flow; cooling; flow simulation; forced convection; heat sinks; packaging; railways; temperature distribution; turbulence; Nusselt number; Reynolds number; air flow; channel height; electronics cooling; fin base thickness; fin height; fin interruption; fin staggering; fin thickness; fin tip clearance gap; forced convection; global heat transfer parameters; heat transfer coefficient; high power dissipation removal; hydrodynamically developing flow; inter-fin spacing; local heat transfer parameters; long term reliability; maximum heat sink temperature; people movers; pressure drop; rail transportation systems; serrated plate fin heat sinks; serration spacing; temperature distribution; thermal performance; thermally developing flow; three-dimensional numerical simulations; turbulent convection; turbulent flow; Distributed computing; Electronic equipment; Electronics cooling; Heat sinks; Heat transfer; Numerical simulation; Power dissipation; Power system reliability; Rail transportation; Temperature distribution;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on
ISSN
1089-9870
Print_ISBN
0-7803-7152-6
Type
conf
DOI
10.1109/ITHERM.2002.1012467
Filename
1012467
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