DocumentCode
1846396
Title
Thermal/fluid characteristics of 3-D woven mesh structures as heat exchanger surfaces
Author
Wirtz, R.A. ; Xu, Jun ; Park, Ji-Wook ; Ruch, Dan
Author_Institution
Dept. of Mech. Eng., Nevada Univ., Reno, NV, USA
fYear
2002
fDate
2002
Firstpage
307
Lastpage
314
Abstract
The present work demonstrates the fabrication methodology of a 3-D, aluminum wire filament, bonded mesh deployed as a heat exchange surface. A model of the effective thermal conductivity of the mesh is developed. Apparatus to measure the coolant pressure-drop and heat transfer coefficient are described. Measurements are reported for fabricated test samples of varying thickness. Mesh Stanton number and friction factor correlations for a coolant with Prandtl number equal to 9.5 (chilled water) are reported. A heat exchanger performance evaluation, comparing the 3D woven mesh technology to another exchanger surface technology, is described. We have found that the weaving/wire bonding process must be carefully controlled to insure that target porosity, specific surface area and effective thermal conductivity are achieved. Effective thermal conductivities are found to be at least two-times larger than achieved in other comparable porous media configurations. Mesh friction factor and Stanton number are comparable to those achieved with other exchanger surface technologies. The exchanger performance comparison shows that exchangers having superior performance can be configured.
Keywords
aluminium; heat exchangers; lead bonding; porosity; thermal conductivity; thermal management (packaging); 3D woven mesh structure; Al; Prandtl number; Stanton number; aluminum wire filament; coolant pressure drop; fabrication method; fluid characteristics; friction factor; heat exchanger surface; heat transfer coefficient; porosity; specific surface area; thermal conductivity; weaving process; wire bonding; Aluminum; Bonding; Coolants; Fabrication; Friction; Heat transfer; Testing; Thermal conductivity; Thickness measurement; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on
ISSN
1089-9870
Print_ISBN
0-7803-7152-6
Type
conf
DOI
10.1109/ITHERM.2002.1012472
Filename
1012472
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