DocumentCode :
1846782
Title :
Vibration-induced droplet atomization heat transfer cell for high-heat flux applications
Author :
Heffington, S.N. ; Black, W.Z. ; Glezer, A.
Author_Institution :
George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fYear :
2002
fDate :
2002
Firstpage :
408
Lastpage :
412
Abstract :
This paper describes a unique two-phase cooling method that includes a closed heat transfer cell, similar to a thermosyphon that can be used to cool microelectronic packages. The cooling method is based upon a Vibration-Induced Droplet Atomization, or VIDA, process that can generate small liquid droplets inside a closed cell and propel them onto a heated surface. The VIDA technique involves the violent break-up of a liquid film into a shower of droplets by vibrating a piezoelectric actuator and accelerating the liquid film at resonant conditions. The droplets continually coat the surface with a thin liquid film, which evaporates on the heated surface, and the vapor is condensed on the internal surfaces of the heat transfer cell as well as the liquid working fluid. The condensed liquid is returned via gravity to the piezoelectric actuator where it is again atomized. A VIDA heat transfer cell 50 mm in diameter and 20 mm thick was constructed. Test data described in this study include the heat transfer characteristics and cooling capabilities for a small-scale cell that is suitable for cooling a desktop microprocessor during the burn-in portion of the manufacturing process. The VIDA process produces droplets of relatively uniform diameter, and the droplets have sufficient momentum to reach the remotely located heated source. Heat fluxes as high as 200 W/cm2 have been measured when a chilled water heat exchanger is used as the external heat removal device.
Keywords :
cooling; drops; evaporation; thermal management (packaging); vibrations; 20 mm; 50 mm; VIDA; burn-in; closed heat transfer cell; condensed liquid; diameter 50 mm; droplets; gravity; heat transfer cell; heated surface; microelectronic packages; piezoelectric actuator; resonant conditions; thermosyphon; thickness 20 mm; two-phase cooling; vibration-induced droplet atomization; Acceleration; Cooling; Heat transfer; Microelectronics; Packaging; Piezoelectric actuators; Piezoelectric films; Propulsion; Resonance; Water heating;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on
ISSN :
1089-9870
Print_ISBN :
0-7803-7152-6
Type :
conf
DOI :
10.1109/ITHERM.2002.1012485
Filename :
1012485
Link To Document :
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