• DocumentCode
    1846806
  • Title

    A system design approach to liquid-cooled microprocessors

  • Author

    Dickinson, Randall D. ; Novotny, Steffen ; Vogel, Marlin ; Dunn, John

  • Author_Institution
    ThermoNESLAB, Portsmouth, NH, USA
  • fYear
    2002
  • fDate
    2002
  • Firstpage
    413
  • Lastpage
    420
  • Abstract
    This paper describes a compact fluid-cooled computer system, comprised of micro-channel heat exchangers, a fan, and a small pump, to remove heat from a microprocessor. Computational fluid dynamic analysis was used to determine the optimal micro-channel fin array design. Normal flow heat exchanger (NFHX) and parallel flow heat exchanger (PFHX) designs were evaluated. Due to packaging constraints, a micro-channel radiator was used. Integral to the radiator design was the selection of a reliable 30 SCFM blower. Fluid flow and pressure requirements were on the order of 0.5 LPM and 4 PSID respectively. The cooling system developed provided a heatsink to air thermal resistance of 0.155°C/W. An understanding was developed of the effect of airflow, liquid-flow, and heatload on the system performance leading to work which would achieve a heatsink to air thermal resistance of 0.100°C/W and lower.
  • Keywords
    computational fluid dynamics; cooling; heat exchangers; microfluidics; reliability; thermal management (packaging); thermal resistance; air thermal resistance; computational fluid dynamic analysis; cooling; fan; fluid-cooled computer; heat load; heat sink; micro-channel heat exchangers; micro-channel radiator; optimal micro-channel fin array; packaging; parallel flow heat exchanger; pump; pump reliability; radiator design; Computational fluid dynamics; Cooling; Fluid flow; Heat pumps; Microprocessors; Packaging; Resistance heating; System analysis and design; System performance; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on
  • ISSN
    1089-9870
  • Print_ISBN
    0-7803-7152-6
  • Type

    conf

  • DOI
    10.1109/ITHERM.2002.1012486
  • Filename
    1012486