Title :
Characterization of Surface Mount Components at Microwave Frequencies using Wafer Probes
Author :
Godshalk, Ed ; Sundberg, Garth
Author_Institution :
Maxim Integrated Products and Oregon State University
Abstract :
Calibrated measurements may be performed in a printed circuit board (PCB) environment using microstrip elements and ultra small surface mount components as calibration standards. The calibration technique allows surface mount components and packages to be characterized from VHF to microwave frequencies. The use of microwave wafer probes for connection to the PCB is described.
Keywords :
Calibration; Coplanar waveguides; Inductance; Measurement standards; Microstrip; Microwave frequencies; Packaging; Probes; Surface-mount technology; VHF circuits;
Conference_Titel :
ARFTG Conference Digest-Spring, 53rd
Conference_Location :
Anaheim, CA, USA
Print_ISBN :
0-7803-5686-1
DOI :
10.1109/ARFTG.1999.327346
