DocumentCode :
1847389
Title :
A two-port analytical model for thermal characterization boards
Author :
Stout, Roger P.
Author_Institution :
Adv. Packaging Technol., ON Semicond., Phoenix, AZ, USA
fYear :
2002
fDate :
2002
Firstpage :
572
Lastpage :
579
Abstract :
Thermal characteristics of packaged semiconductor devices are difficult to compare, especially between suppliers and sometimes even across packages from the same supplier. Yet at a fundamental level, "standard" thermal test boards are relatively simple thermal systems characterized by just a few critical parameters, and they should respond simply and consistently to thermal inputs (that is, a heat source of certain dimensions and power level). There should be a means by which data taken on one style of board could be extrapolated quickly and reasonably accurately to any other type of standard test board. To this end, an axisymmetric thermal model (essentially a 1D cylindrical "fin") is developed and its closed-form solution expressed as a two-port network (heat flow and temperature, in and out). The resulting two-port network is utilized to describe a more complex thermal model consisting of multiple regions of differing thermal properties. Its application to thermal characterization of semiconductor devices is discussed, as an example demonstrating the relationship between so called "min pad" and "1-inch pad" device characteristics. The model is also compared to other experimental data, where the "best fit" of the axisymmetric model shows a reasonable correlation with the normalized temperature values of the experiment.
Keywords :
semiconductor device models; semiconductor device packaging; semiconductor device testing; thermal management (packaging); two-port networks; 1D cylindrical fin; axisymmetric thermal model; semiconductor device package; thermal characteristics; thermal test board; two-port analytical model; Analytical models; Circuit testing; Geometry; Printed circuits; Semiconductor device packaging; Semiconductor device testing; Semiconductor devices; System testing; Temperature; Thermal conductivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on
ISSN :
1089-9870
Print_ISBN :
0-7803-7152-6
Type :
conf
DOI :
10.1109/ITHERM.2002.1012506
Filename :
1012506
Link To Document :
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