DocumentCode
1847409
Title
Raised floor computer data center: effect on rack inlet temperatures of chilled air exiting both the hot and cold aisles
Author
Schmidt, Roger ; Cruz, Ethan
Author_Institution
IBM Corp., Poughkeepsie, NY, USA
fYear
2002
fDate
2002
Firstpage
580
Lastpage
594
Abstract
This paper focuses on the effect of the rack inlet temperatures resulting from chilled air exhausting from perforated tiles situated in both the hot and cold aisles of a raised floor data center. Only the above floor (raised floor) flow and temperature distributions were analyzed for various flowrates exhausting from the perforated tiles. A Computational Fluid Dynamic(CFD) model was generated for the room with electronic equipment installed on a raised floor with particular focus on the effects on rack inlet temperatures of equipment heat load, placement of air conditioning (A/C) units and chilled air flowrates. Forty racks of data processing (DP) equipment were arranged in rows in a data center cooled by chilled air exhausting from perforated floor tiles. The chilled air was provided by four A/C units placed inside a room 12.1 m wide x 13.4 m long. Since the arrangement of the racks in the data center was symmetric only one-half of the data center needed to be modeled. The numerical modeling was performed using a commercially available finite control volume computer code called Flotherm (Trademark of Flomerics, Inc.). The flow was modeled using the k-e turbulence model. Results are displayed to provide some guidance on the design and layout of a data center.
Keywords
air conditioning; computational fluid dynamics; computer centres; finite volume methods; temperature distribution; thermal management (packaging); turbulence; Flotherm; air conditioning; chilled air exhaust; cold aisle; computational fluid dynamic model; data processing; electronic equipment; finite control volume computer code; heat load; hot aisle; k-e turbulence model; numerical simulation; perforated tile; rack inlet temperature; raised floor computer data center; temperature distribution; thermal management; Computational modeling; Data engineering; Data processing; Electronic equipment; Floors; Numerical models; Rapid thermal processing; Temperature distribution; Thermal management; Tiles;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on
ISSN
1089-9870
Print_ISBN
0-7803-7152-6
Type
conf
DOI
10.1109/ITHERM.2002.1012507
Filename
1012507
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