A Novel De-embedding Technique for Millimeter-wave Package Characterization

This paper describes a novel de-embedding technique for millimeter-wave BGA package characterization using accurate 2-port measurement. By calculating the S-matrix of the discontinuity between the probes and the DUT, the procedure can overcome the difficulties of designing a broadband reflection standard in TRL calibration due to the large distance between probing pad and the interface with the DUT. The method presented is self-consistent and can be easily applied to S-parameter calculation and de-embedding of general discontinuities.